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Base plate and base plate joint device employing same

A technology for bonding devices and substrates, which is applied in the direction of assembling printed circuits with electrical components, electrically connecting printed components, and printed circuit components, etc., and can solve the problems of substrate falling off, limited layout space, poor contact, etc.

Active Publication Date: 2012-05-23
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is the traditional bonding method between the flexible substrate and the rigid substrate. However, the bonding area of ​​the bonding part 14 is often limited by the space for electronic components on the substrate, resulting in insufficient bonding strength between the two substrates. Pulling by external force during the assembly process, resulting in problems such as substrate falling off or poor contact

Method used

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  • Base plate and base plate joint device employing same
  • Base plate and base plate joint device employing same
  • Base plate and base plate joint device employing same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0055] Please refer to Figure 3A and 3B , which is a schematic diagram of a substrate bonding apparatus according to a first embodiment of the present invention. The substrate bonding device 300 includes a first substrate 310 and a second substrate 320 . The first substrate 310 can be a rigid substrate, and the second substrate 320 can be a flexible substrate. Such as Figure 3A As shown, the first substrate 310 has a first electrical junction 312 and a first reinforced junction 314 that are electrically isolated from each other, and the second substrate 320 has a second electrical junction 322 and a second electrical junction 322 that are electrically isolated from each other. A second reinforced joint portion 324 .

[0056] It should be noted that, the second substrate 320 of this embodiment can be as figure 2 The double-metal layer or multi-metal layer structure of the substrate 200, the first substrate 310 of this embodiment can adopt such as figure 2 The single m...

no. 2 example

[0061] Please refer to FIGS. 4A and 4B , which illustrate a schematic diagram of a substrate bonding device according to a second embodiment of the present invention. The difference between the substrate bonding apparatus 400 of this embodiment and the above-mentioned first embodiment lies in the relative bonding positions of the first substrate and the second substrate, and other features are similar to those of the first embodiment, and will not be repeated here. exist Figure 4A Among them, the first substrate 410 has two opposite long sides 410b, and the first electrical joint portion 412 and the first reinforced joint portion 414 are respectively adjacent to the two opposite long sides 410b. In addition, the second substrate 420 has an end edge 420a, the second electrical joint part 422 and the second reinforced joint part 424 are adjacent to the end edge 420a, and the second electrical joint part 412 is located between the end edge 420a and the second reinforced joint pa...

no. 3 example

[0065] Please refer to Figure 5A and 5B , which is a schematic diagram of a substrate bonding apparatus according to a third embodiment of the present invention. The difference between the substrate bonding apparatus 500 of this embodiment and the above-mentioned first embodiment lies in the substrate type of the first substrate, and other features are similar to those of the first embodiment, and will not be repeated here. The substrate bonding device 500 includes a first substrate 510 and a second substrate 520 . Both the first substrate 510 and the second substrate 520 may be flexible substrates.

[0066] when Figure 5A The second electrical bonding portion 522 and the second strengthening bonding portion 524 of the second substrate 520 are respectively connected with Figure 5A The first electrical junction part 512 and the first reinforced junction part 514 of the first substrate 510 in the Figure 5B The substrate bonding apparatus 500. In addition to the two com...

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PUM

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Abstract

Disclosed are a base plate and a base plate joint device employing same. The base plate comprises substrate, an upper metal layer and a lower metal layer, and an upper covering layer and a lower covering layer; the substrate is provided with an upper surface, a lower layer and a via hole penetrating through the substrate, the upper and lower metal layers are respectively arranged on the upper andlower surfaces of the substrate, and the upper and lower covering layers respectively cover the upper and lower metal layers. The lower metal layer is provided with an electric joint part and a reinforced joint part separated from each other electrically. The reinforced joint part is used for improving the joint strength of the base plate and the other base plate. The upper metal layer is electrically connected with the electric joint part through the via hole. A second electric joint part and the reinforced joint part are exposed out of the lower covering layer to be respectively jointed with the two joint parts of the other base plate.

Description

【Technical field】 [0001] The present invention relates to a substrate and a substrate bonding device using the same, and in particular to a substrate having at least a double metal layer and a substrate bonding device using the same. 【Background technique】 [0002] A printed circuit board (PCB) is a support for electronic components and provides circuit connections between electronic components. The base material of the printed circuit board can be bakelite board, glass fiber board, or various plastic boards; for example: FR-4 substrate is a substrate that uses glass fiber board as the base material. [0003] Flexible Printed Circuit (FPC) is a light-weight, thin, flexible, and bendable printed circuit board that is widely used in mobile phones, notebook computers, PDAs, digital cameras, liquid crystal displays, and other products. [0004] Please refer to figure 1 , which shows a conventional schematic view of a flexible circuit board with a single-layer conductive copper...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/36
Inventor 王崇权黄启祥许子辉
Owner AU OPTRONICS CORP