Tin printed steel net and tin paste printing method

A technology of steel mesh and copper foil, which is used in the assembly of printed circuits with electrical components and the formation of conductive patterns, which can solve the problems of solder balls and insufficient solder paste, and achieve the effect of ensuring stability and reducing manufacturing costs.

Inactive Publication Date: 2013-04-24
DONGGUAN SHINANO MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a tin printing stencil and a method of printing solder paste to provide enough solder paste on the copper foil pad, and solve the problem that the amount of solder paste is insufficient and additional solder paste needs to be added with tin wire The problem of solder balls when measuring

Method used

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  • Tin printed steel net and tin paste printing method
  • Tin printed steel net and tin paste printing method
  • Tin printed steel net and tin paste printing method

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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0026] figure 1 It is a schematic diagram of the layout of the openings of the tin printing stencil of the present invention. exist figure 1 Among them, copper foil pads 2 for soldering are prepared on the substrate 1 of the printed circuit board, and the openings 3 of the tin printing stencil are correspondingly arranged above the copper foil pads 3 . from figure 1 It can be seen that the area of ​​the opening 3 is larger than the area of ​​the copper foil pad 2 . Among them, the most suitable opening 3 of the tin printing stencil is determined according to the shape of the copper foi...

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Abstract

The invention relates to a tin printed steel net which comprises an opening part corresponding to a copper foil welding disc arranged on a base plate, wherein the area of the opening part of the base plate is more than 1.5 times of that of the copper foil welding disc, and the most proper opening of the tin printed steel net is determined according to the shape of the copper foil welding disc andthe size of devices to be installed. Because the area of the opening part is greater than that of the copper foil welding disc, the tin quantity addition through tin wires, the tin ball removal through a brush and the check on whether the tin ball removal is completed or not are not needed. In addition, adverse potential quality hazard of short circuit because of tin balls can be eliminated, and the goals of material saving and environment improvement can be achieved. Moreover, compared with the prior art, the invention reduces the manufacture cost of the tin printed steel net on the basis ofensuring the stability of the tin paste. In addition, the invention also provides a tin paste printing method.

Description

technical field [0001] The invention belongs to the field of printed circuits. Specifically, the present invention mainly relates to a tin printing stencil and a method for printing solder paste. The tin printing stencil and the method for printing solder paste of the present invention are especially suitable for circuit boards with low wiring density. Background technique [0002] As we all know, printed circuit boards are also called PCB boards, PCB circuit boards, flexible boards and so on. It has been widely used in communication, home appliances and other fields. Chips and IC integrated circuits are the food of the electronic information industry. Semiconductor technology reflects a country's industrial modernization level and guides the development of the electronic information industry. The electrical interconnection and assembly of semiconductors and integrated circuits must rely on circuit boards. Usually, various components are soldered to the printed circuit bo...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H05K3/34H05K3/12
Inventor龚道平恩和
OwnerDONGGUAN SHINANO MOTOR CO LTD