Unlock instant, AI-driven research and patent intelligence for your innovation.

Rfid inlet and rfid tag, and method for manufacturing rfid inlet and rfid tag

A technology of RFID tags and manufacturing methods, which is applied in the direction of recording carriers, antennas, antenna supports/mounting devices used in machines, etc., can solve the problems of printing quality degradation, IC chip damage, and printing inability, and eliminate the problems that cannot be printed area effect

Inactive Publication Date: 2012-02-08
HITACHI LTD
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If there are irregularities on the printing surface during printing, problems such as deterioration of printing quality, inability to print, and damage to the printing surface may occur
In particular, since the thickness of the IC chip is at least 30 μm, the part where the IC chip exists is thicker than other parts, so there is a risk of breaking the IC chip

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Rfid inlet and rfid tag, and method for manufacturing rfid inlet and rfid tag
  • Rfid inlet and rfid tag, and method for manufacturing rfid inlet and rfid tag
  • Rfid inlet and rfid tag, and method for manufacturing rfid inlet and rfid tag

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] The first embodiment will be described.

[0056] Among the RFID tag manufacturing processes described above (1), the process of manufacturing an RFID unlaminated card 10 having an underfill coating control area can be further divided into: (1-1) having an underfill coating control area An RFID antenna manufacturing process; and (1-2) a process of mounting an IC chip and applying and baking an underfill to manufacture an RFID unlaminated card.

[0057] Hereinafter, the process of each of the above steps will be described in detail.

[0058] (1-1) RFID antenna manufacturing process with underfill coating control area

[0059] use Figure 2A and B describe in detail the process flow of the RFID antenna manufacturing process with the underfill coating control area in this embodiment. Figure 2A Each processing step and the cross-sectional structure of the element in each processing step are shown in .

[0060] First, the base film 2 made of an aluminum foil 1 with a thi...

Embodiment 2

[0075] A second embodiment of the present invention will be described.

[0076] This embodiment is the result of changing a part of the manufacturing process of the RFID antenna having the underfill coating control area (1-1) among the processes described in the first embodiment. use Figure 5 A specific example thereof will be described.

[0077] The present embodiment is characterized in that, for the method of manufacturing the RFID unlaminated card 10 that controls the underfill application area, it is manufactured using a dual-purpose positive / negative resist. Photoresists are generally classified as negative or positive, and are used according to the application. There are also positive / negative dual-purpose resists. It can be reversed from negative type to positive type or from positive type to negative type by exposure to radiation source and exposure intensity, developer solution, and the like.

[0078] like Figure 5 As shown, first, a metal foil 1 as an antenna ...

Embodiment 3

[0080] A third embodiment of the present invention will be described.

[0081] This example is the result of changing a part of the manufacturing process of the RFID antenna having the underfill application control region (1-1) among the steps described in the first example. use Image 6 A specific example thereof will be described.

[0082] The antenna 1 is formed by screen printing on the substrate (base film) 2 of the RFID unlaminated card using paste such as silver paste without using a resist when forming the antenna 1 (S601). Therefore, the resist 3 or 30 used in Example 1 and Example 2 can also be used on such an antenna, but in terms of the performance of the antenna 1, it is preferable to provide a hole for controlling the underfill application area. 201 of the perforated film 20 (S602). This is because when the antenna 101 is formed by screen printing, there are many voids inside the antenna, and when the resist penetrates into the voids, the dielectric constant a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The object of the invention is to provide a planarized RFID tag with its upper or back surface or upper / back surfaces printed for use by removing the unprinted region. An RFID inlet by including: a base film; an antenna pattern formed on the base film; an insulation film layer formed on the antenna pattern and having a hole; an IC chip coupled to the antenna pattern inside the hole of the insulation film layer; and an underfill filled between the IC chip, the antenna, and the base film. The height of the IC chip top surface is at a higher level than the top surface of the insulation film layer, the underfill is formed between the IC chip and a wall surface of the hole of the insulation film layer.

Description

technical field [0001] The present invention relates to an RFID label used for printing on the front or back or the front and back, and a manufacturing method thereof, and provides a structure for improving unevenness on the front or back that hinders printing or degrades printing quality, and achieves flattening. Background technique [0002] In recent years, RFID (Radio Frequency Identification, radio frequency identification) tags are processed into a tag shape or a card shape, and are widely used in forms such as installing on objects for information management of the objects. RFID tags are manufactured by bonding film or paper to the front or back of a structure called an unlaminated card (inlet) consisting of an IC chip and an antenna, depending on the purpose and use. [0003] Various information such as ID (Identification: identification information) stored in the IC chip can communicate wirelessly with the reader-writer through the antenna, and the reader-writer can...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077H01Q1/22H01Q1/38
CPCG06K19/0772G06K19/07722G06K19/07754H01L2224/16225H01L2224/16227H01L2224/81191H01L2924/00014H01Q1/2208H01L2224/0401G06K19/07
Inventor 皆川圆谏田尚哉坂间功佐川茂柴田大辅
Owner HITACHI LTD