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Cutting method

A cutting method and technology of cutting blades, which are applied in the fields of electrical components, fine working devices, semiconductor/solid-state device manufacturing, etc., can solve the problems of deterioration of processing quality, multiple cracks, large defects, etc., and achieve the effect of reducing the deterioration of processing quality

Active Publication Date: 2016-02-10
DISCO CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, when the wafer is diced in the above-mentioned procedure, it is observed that the plurality of first planned division lines that are cut first have larger defects or more cracks than the plurality of second planned division lines that are cut next. Unfavorable situation, the result sometimes leads to deterioration of processing quality

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Embodiment Construction

[0028] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

[0029] (1) Semiconductor wafer

[0030] figure 1 A state in which a semiconductor wafer (hereinafter simply referred to as a wafer) as a workpiece to be processed is cut by the cutting blade 13 of the cutting unit 10 using the cutting method of one embodiment is shown. Such as figure 2 As shown, on the surface of the wafer 1 , a plurality of dividing lines 2 intersecting each other are formed in a grid pattern, and rectangular device regions 3 divided by these dividing lines 2 are formed.

[0031] On the surface of each device region 3 , an electronic circuit (not shown) made of IC, LSI, or the like is formed. The planned dividing lines 2 dividing the device regions 3 are perpendicular to each other in this embodiment. here, will be in figure 2 In the following description, the planned dividing line extending in the A direction (first direction) is referred to...

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Abstract

PROBLEM TO BE SOLVED: To provide a cutting method in which, when a plurality of first and second predetermined dividing lines crossing each other are cut, deterioration in processing quality generated in the first lines to be cut first can be reduced. SOLUTION: When dicing is performed by cutting first and second predetermined dividing lines 2a and 2b in a form of a lattice, which partition a device region 3 in a semiconductor wafer 1, a cutting method comprises: a first cutting step for cutting the first predetermined dividing lines 2a so as to skip at least the adjacent first predetermined dividing lines 2a, for example, at intervals of one line or two lines, instead of first cutting all the first predetermined dividing lines 2a; thereafter a second cutting step for cutting the second predetermined dividing lines 2b; and thereafter a third cutting step for cutting the other first predetermined dividing lines 2a. COPYRIGHT: (C)2012,JPO&INPIT

Description

technical field [0001] The present invention relates to a cutting method suitable for use when cutting and dividing a thin plate-shaped workpiece such as a semiconductor wafer with a cutting blade. Background technique [0002] For example, in a semiconductor device manufacturing process, first, on the surface of a wafer made of a semiconductor such as silicon or gallium arsenide (GaAs), a plurality of first planned dividing lines extending in the first direction are formed in a grid pattern, and A plurality of second planned dividing lines extending in a second direction intersecting with the first direction, and then, in a rectangular device region divided by these first planned dividing lines and second planned dividing lines, an IC-based or multiple circuit elements such as LSI. Then, after the back surface of the wafer is ground and thinned to a predetermined thickness, dicing is performed to cut and divide the device region along each planned dividing line, thereby ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/78B28D5/00
Inventor 冯宇伟
Owner DISCO CORP