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Method for Identifying Abrasive Performance of Chemical Mechanical Abrasive Equipment

A grinding performance, chemical mechanical technology, applied in the direction of grinding devices, grinding machine tools, grinding tools, etc., can solve the problem of high flatness of grinding rate

Active Publication Date: 2018-02-09
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the U-shaped fine grinding pad was first used, the problem of high flatness of the grinding rate occasionally occurred

Method used

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  • Method for Identifying Abrasive Performance of Chemical Mechanical Abrasive Equipment
  • Method for Identifying Abrasive Performance of Chemical Mechanical Abrasive Equipment
  • Method for Identifying Abrasive Performance of Chemical Mechanical Abrasive Equipment

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Embodiment Construction

[0021] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.

[0022] The present invention can be improved for CMP equipment similar to the Ebara CMP machine and so on, and the CMP equipment such as the Ebara CMP machine improved by the present invention has a main grinding pad (grinding W) and a fine grinding pad (grinding silicon oxide) , the two are relatively independent parts, the technical scheme of the present invention can be improved for the fine grinding pad, wherein the fine grinding pad of the Ebara CMP machine has two shapes, U-shaped and circular; this U-shaped fine grinding pad There are grooves in the X and Y directions, and the grooves are surrounded by small squares (usually rectangular). These grooves are rolled out by rollers in the X and Y directions during manufacture. Due to deformati...

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PUM

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Abstract

The invention discloses a method for identifying polishing characteristics of chemical mechanical polishing equipment. The method includes providing a U-shaped buffer pad for a polishing pad; leading a trimming component to realize trimming on the U-shaped buffer pad only along a fixed trimming direction; testing bending strength of a bent portion of the U-shaped buffer pad, and judging the polishing characteristics of the chemical mechanical polishing equipment according to the bending strength of the bent portion of the U-shaped buffer pad. Steps for testing the bending strength of the bent portion of the U-shaped buffer pad include placing a measuring weight with the known weight on the bent portion of the U-shaped buffer pad; measuring the length of the bent portion of the U-shaped buffer pad and downwards pressing depth of the U-shaped buffer pad due to the weight of the measuring weight; and computing the bending strength of the bent portion of the U-shaped buffer pad according to the length and the depth.

Description

technical field [0001] The present invention relates to the field of semiconductor manufacturing, in particular to a chemical mechanical polishing (CMP) process, more specifically to a method for identifying the grinding performance of chemical mechanical polishing equipment and a method for identifying the grinding performance of chemical mechanical polishing equipment method of chemical mechanical polishing. Background technique [0002] In the chemical mechanical polishing process, the dressing tool (such as Nylon Brush) of the chemical mechanical polishing fine grinding pad is used to remove the impurity material on the polishing pad and keep the surface of the polishing pad clean (fresh), thereby maintaining the surface film of the silicon wafer during the grinding process The removal speed and the flatness of the grinding speed. [0003] figure 1 Schematically shows the structure of chemical mechanical polishing equipment. Such as figure 1 As shown, the chemical me...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/26B24B37/04
Inventor 李协吉张泽松程君李志国
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP