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Heat dissipation structure of double-sided heating element

A technology of heat dissipation structure and heating element, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of inability to achieve heat transfer, inability to contact or connect with each other, and inability to transfer heat from the main heat dissipation components to the outside.

Inactive Publication Date: 2013-01-30
ORMON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if there are manufacturing errors in the heating element itself, or the sizes of different heating elements suitable for the heat dissipation structure are different, the two heat dissipation components of the double-sided heat dissipation structure may not be able to contact or connect with each other, resulting in a gap between the two. The heat transfer cannot be realized, and the heat of the main heat dissipation component cannot be transferred outward, and the heat dissipation efficiency of the entire heat dissipation structure is low
In this case, the heat of the double-sided heating element cannot be effectively transferred to the surrounding environment, resulting in a reduction in the service life of the double-sided heating element, which in turn leads to a reduction in the service life of the entire product

Method used

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  • Heat dissipation structure of double-sided heating element
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  • Heat dissipation structure of double-sided heating element

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Embodiment Construction

[0019] The heat dissipation structure described in the present invention can be used in various occasions using double-sided heating elements. Next, the heat dissipation structure provided by the present invention will be described in detail with reference to preferred embodiments of the present invention and the accompanying drawings.

[0020] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments according to the present invention will be described below with reference to the appended drawings. According to the first embodiment of the present invention, a heat dissipation structure for a double-sided heating element is provided. More specifically, the appended instructions figure 1 is a perspective view of an assembled state of the heat dissipation structure according to the first embodiment of the present invention. Instructions attached figure 2 yes figure 1 An exploded view of the heat dissipation structure of the first embodiment of the present inve...

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Abstract

The invention relates to a heat dissipation structure of a double-sided heating element which is provided with a main heating plane and an auxiliary heating plane. The heat dissipation structure comprises a main heat dissipation component and an auxiliary heat dissipation component, wherein the main heat dissipation component comprises a main component main body and a main component end part which is provided with at least one main abutting plane, and the auxiliary heat dissipation component comprises an auxiliary component main body and an auxiliary component end part which is provided with at least one auxiliary abutting plane. When the heat dissipation structure is in an assembling state, the double-sided heating element is located between the main component main body and the auxiliary component main body, a main component internal surface is abutted with the main heating plane, an auxiliary component internal surface is abutted with the auxiliary heating plane, and the at least one main abutting plane is abutted with the corresponding auxiliary abutting plane. Through the structure, the main heat dissipation component and the auxiliary heat dissipation component are in contact with each other under the conditions that the double-sided heating element is subjected to manufacturing errors and the like, so as to guarantee the heat transfer between the main heat dissipation component and the auxiliary heat dissipation component, and then, the heat dissipation efficiency of the whole heat dissipation structure is effectively improved, so that the service life of the whole product is prolonged.

Description

technical field [0001] The invention relates to a heat dissipation structure of a double-sided heating element. Background technique [0002] Electronic devices, especially small electronic devices such as power supplies and electronic switches, usually contain small but high-heating heating elements. Generally speaking, this type of heating element has two heating surfaces, specifically a main heating surface that generates more heat, and an auxiliary heating surface that generates less heat and is opposite to the main heating surface. [0003] In order to effectively dissipate heat from the above-mentioned heating elements, the prior art usually uses a single-sided heat dissipation structure with a part attached to the main heating surface or a double-sided heat dissipation structure with two different heat dissipation components that are in contact with the two heating surfaces at the same time. structure. However, when using a single-sided heat dissipation structure, s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 陈小军
Owner ORMON CORP