Glue overflow control method of laminar structure

Abstract

An embodiment of the invention provides a glue overflow control method of a laminar structure. The glue overflow control method comprises the steps of providing at least two single-layer plates stacked in sequence, enabling half-solidified plates to be contained in the single-layer plates to be used for adhering every two adjacent single-layer plates; forming blocking glue layers surrounding side walls of the single-layer plates; performing press fit on a plurality of single-layer plates after the blocking glue layers are surrounded on the side walls of the single-layer plates to enable the half-solidified plates to adhere every two adjacent single-layer plates so as to form a multi-layer plate. Due to the blocking glue layers, the center and the periphery of the formed multi-layer plate are uniform in thickness. In press fit, the peripheries of the single-layer plates are of sealed or similarly sealed structures, overflow of melted glue can be effectively avoided, conditions of long glue edges are avoided, a next process step can be entered after press fit is finished, drilling is performed on the formed multi-layer plate, and a milling process is omitted.

Description

technical field [0001] The invention relates to the field of PCB high-density packaging, in particular to a method for controlling glue overflow of a laminated structure. Background technique [0002] The PCB substrate is usually a multi-layer board (that is, the board in process). The existing multi-layer board is usually made of a single-layer board (core board) first, and then the single-layer boards are stacked, and the single-layer boards are pressed together by pressing. Integral multi-layer board. [0003] figure 1 It is a schematic diagram of the pressing principle of the existing multi-layer board. Please refer to figure 1 , the laminated multilayer board 17 includes a plurality of stacked single-layer boards, each single-layer board includes a prepreg, and at least one side of the prepreg is formed with a circuit layer, respectively: the first prepreg 11, The material is a prepreg, and the first prepreg 11 is formed with a first circuit layer 111 (the first pre...

AI Technical Summary

Problems solved by technology

[0005] However, in the prior art, in the process of laminating the multiple single-layer boards to form multi-layer boards, it is easy to overflow glue and produce long glue edges, and it is also necessary to mill the sides of the laminated multi-layer boards, which increases the process

Images