Glue overflow control method of laminar structure

A control method and technology of lamination structure, applied in the direction of multi-layer circuit manufacturing, etc., can solve problems such as adding processes, and achieve the effect of promoting glue curing and speeding up progress

Active Publication Date: 2013-06-05
JIANGNAN INST OF COMPUTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the prior art, in the process of laminating the multiple single-layer boards to form multi-layer boards, it is easy to overflow glue and produce long glue edges, and it is also necessary to mill the sides of the laminated multi-layer boards, which increases the process

Method used

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  • Glue overflow control method of laminar structure
  • Glue overflow control method of laminar structure
  • Glue overflow control method of laminar structure

Examples

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no. 1 example

[0040] Please refer to Figure 3-Figure 6 , Figure 3-Figure 6 A schematic cross-sectional structure showing the glue overflow control process of the laminated structure according to the embodiment of the present invention.

[0041] Please refer to image 3 , at least two single-layer boards stacked in sequence are provided, and the single-layer boards include a prepreg for bonding two adjacent single-layer boards.

[0042] The stacked single-layer boards are used for subsequent pressing to form multi-layer boards. Take two stacked single-layer boards as an example for demonstration.

[0043] In the embodiment of the present invention, it includes: a first single-layer board (not marked), the first single-layer board includes a first prepreg 201, and the first circuit formed on the first prepreg 201 layer 203 ; a second single-layer board (not labeled), the second single-layer board includes a second prepreg 205 , and a second circuit layer 207 formed on the second prepreg...

no. 2 example

[0062] Different from the first embodiment of the present invention, in the second embodiment of the present invention, the adhesive resist layer 209 is a high temperature resistant polyimide (hereinafter referred to as "PI") tape (not shown). After the multiple single-layer boards are stacked and placed in sequence, a high-temperature-resistant adhesive tape is wound around the multiple single-layer boards to prevent glue overflow.

[0063] In order to facilitate the air discharge between two adjacent single-layer boards without affecting the effect of subsequent lamination, the surface of the high temperature resistant PI tape has multiple gaps, for example, 1-30 gaps with a width of 0.5-2.0 mm.

[0064] In the second embodiment of the present invention, high-temperature-resistant tape is used as the glue-resisting layer, which is easy to operate and effectively prevents overflowing glue from forming long glue edges. The plate is drilled, saving the milling process.

[0065...

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Abstract

An embodiment of the invention provides a glue overflow control method of a laminar structure. The glue overflow control method comprises the steps of providing at least two single-layer plates stacked in sequence, enabling half-solidified plates to be contained in the single-layer plates to be used for adhering every two adjacent single-layer plates; forming blocking glue layers surrounding side walls of the single-layer plates; performing press fit on a plurality of single-layer plates after the blocking glue layers are surrounded on the side walls of the single-layer plates to enable the half-solidified plates to adhere every two adjacent single-layer plates so as to form a multi-layer plate. Due to the blocking glue layers, the center and the periphery of the formed multi-layer plate are uniform in thickness. In press fit, the peripheries of the single-layer plates are of sealed or similarly sealed structures, overflow of melted glue can be effectively avoided, conditions of long glue edges are avoided, a next process step can be entered after press fit is finished, drilling is performed on the formed multi-layer plate, and a milling process is omitted.

Description

technical field [0001] The invention relates to the field of PCB high-density packaging, in particular to a method for controlling glue overflow of a laminated structure. Background technique [0002] The PCB substrate is usually a multi-layer board (that is, the board in process). The existing multi-layer board is usually made of a single-layer board (core board) first, and then the single-layer boards are stacked, and the single-layer boards are pressed together by pressing. Integral multi-layer board. [0003] figure 1 It is a schematic diagram of the pressing principle of the existing multi-layer board. Please refer to figure 1 , the laminated multilayer board 17 includes a plurality of stacked single-layer boards, each single-layer board includes a prepreg, and at least one side of the prepreg is formed with a circuit layer, respectively: the first prepreg 11, The material is a prepreg, and the first prepreg 11 is formed with a first circuit layer 111 (the first pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor 吴小龙吴梅珠刘秋华徐志徐杰栋胡广群穆敦发周文木
Owner JIANGNAN INST OF COMPUTING TECH
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