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Rigid-flex circuit board and manufacturing method thereof

A technology of circuit board production and combination of soft and hard, applied in the direction of printed circuit parts, electrical components to assemble printed circuits, etc., can solve the problem of high cost of vacuum laminating machine, save equipment investment, simple production process, reduce production The effect of the process

Active Publication Date: 2016-01-27
FLEX PLUS XIAMEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method can avoid the problem of line disconnection caused by residual air, but the cost of the vacuum laminator is relatively expensive, which is nearly 10 times the cost of the ordinary dry film machine

Method used

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  • Rigid-flex circuit board and manufacturing method thereof
  • Rigid-flex circuit board and manufacturing method thereof
  • Rigid-flex circuit board and manufacturing method thereof

Examples

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Comparison scheme
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Embodiment Construction

[0023] Below in conjunction with accompanying drawing, the present invention will be described in further detail:

[0024] A rigid-flex circuit board of the present invention includes a soft board 1 and a hard board 2, the soft board 1 is pure copper, and includes an upper surface and a lower surface, and the upper surface and the lower surface of the soft board are respectively pasted with a protective film 3 and the lower protective film 4, the soft board 1 and the hard board 2 are bonded by hot pressing glue.

[0025] Further, a method for manufacturing a rigid-flex circuit board provides: a flexible board 1 and a rigid board 2, the flexible board 1 is made of pure copper, includes an upper surface and a lower surface, and an upper protective film 3 and a lower protective film 4 are provided.

[0026] Further, the production process of the soft board 1 is as follows:

[0027] Paste a layer of dry film on the upper surface of pure copper and press it with a hot press, then ...

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PUM

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Abstract

The invention provides a flexibility and hardness combined circuit board. The flexibility and hardness combined circuit board comprises a flexible board and a hard board, wherein the flexible board which is made of pure copper comprises an upper surface and a lower surface, the upper surface of the flexible board is attached with an upper protective film, and the lower surface of the flexible board is attached with a lower protective film, and the flexible board and the hard board are bonded through hot-pressing glue. The invention further provides a method for manufacturing the flexibility and hardness combined circuit board. The pure copper of the flexible board is used for replacing a double-faced board, production procedure is reduced, device investment is saved, production cost is reduced, production efficiency and product yield are improved, the hard board is precut, and the purpose of conducting normal circuit manufacturing of the flexibility and hardness combining circuit board can be realized by the utilization of a common film drying machine.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a soft-hard combination circuit board and a manufacturing method thereof. Background technique [0002] With the development and improvement of flexible printed circuit technology, the development and research of soft and hard combined circuit boards have been widely used. The durability and flexibility of soft and hard combined boards, and their strong resistance to harsh application environments make them replace rigid PCB is more suitable for medical and military applications. Rigid-flex circuit boards include soft boards and hard boards. The soft boards and hard boards are manufactured separately and then pressed into a single circuit board. Each rigid-flex circuit board has one or more rigid regions and flexible regions. Among them, the hard board has high flatness and mechanical strength, while the soft board has bendability and high degree of freedom. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/36
Inventor 张艾林
Owner FLEX PLUS XIAMEN
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