Integrated circuit packaging structure and packaging method

Abstract

The invention relates to an integrated circuit packaging structure which comprises a metal pipe shell and a substrate, wherein the two faces of the substrate are respectively provided with a surface-mounted component and a naked chip. The substrate leads out pins connected through tin soldering, wherein each pin is sleeved with a supporting ring for supporting the substrate from a lower portion. Positions, corresponding to the surface-mounted components or heating components in the naked chips, on the upper inner surface and the lower inner surface of the metal pipe shell are provided with radiating structures. Each radiating structure comprises a heat conductive boss arranged on the inner surface of the metal pipe shell in a protruding mode and corresponds to one corresponding heating component and a radiating pad, wherein one face of each radiating pad is in contact with one corresponding heat conductive boss, and the other face of each radiating pad is in contact with the top of one corresponding heating component. The metal pipe shell comprises a pipe shell base and a pipe shell cover plate, wherein the pipe shell base and the pipe shell plate are packaged in an airtight mode through parallel seam welding or laser welding. According to the integrated circuit packaging structure, packaging of the substrate with double-face layout can be achieved, the integration degree of an integrated circuit can be improved, good radiating can be achieved through the heating components on the double faces of the substrate, reliability of the circuit is guaranteed, an impact-proof function is achieved, and the processing process is simple.

Description

technical field [0001] The invention relates to a package structure and a package method of an integrated circuit, in particular to a package structure and a package method with excellent heat dissipation performance. Background technique [0002] The well-known thick-film assembly metal shell structure packaging technology is generally to assemble surface-mounted devices or bare chips on the front of the substrate; only wire or distribute film-like devices on the back of the substrate, so that the entire back is flat; The way of bonding realizes the connection with the tube shell, and finally the tube shell and the cover sheet are seam-welded to realize the fully airtight packaging structure of the metal tube shell. The disadvantage of this packaging structure is that it is a conventional hermetic packaging design with a relatively low integration level, and the heat-generating device cannot establish a heat dissipation channel with the shell, and the heat cannot be directl...

AI Technical Summary

Problems solved by technology

The disadvantage of this package structure is: this is a conventional airtight package design, the integration level is relatively low, the heat dissipation device cannot establish a heat dissipation channel with the shell, and the heat cannot be directly conducted to the shell

The disadvantage of this method is that the heat dissipation device is attached to the integrated circuit chip and the attachment structure to dissipate the heat, but the heat of the integrated circuit chip is not transferred out in the airtight metal tube shell.

The disadvantage of this airtight package heat dissipation structure is: this patent mainly emphasizes the design of airtight heat dissipation structure, and does not involve the heat transfer method and heat dissipation method of internal components

[0005] It can be seen that in the existing packaging technology, the packaging structure and packaging method cannot take into account both the heat dissipation of the device and the hermetic packaging.

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