The invention relates to an
integrated circuit packaging structure which comprises a
metal pipe shell and a substrate, wherein the two faces of the substrate are respectively provided with a surface-mounted component and a naked
chip. The substrate leads out pins connected through
tin soldering, wherein each pin is sleeved with a supporting ring for supporting the substrate from a lower portion. Positions, corresponding to the surface-mounted components or heating components in the naked chips, on the upper inner surface and the lower inner surface of the
metal pipe shell are provided with radiating structures. Each radiating structure comprises a heat conductive boss arranged on the inner surface of the
metal pipe shell in a protruding mode and corresponds to one corresponding heating component and a radiating pad, wherein one face of each radiating pad is in contact with one corresponding heat conductive boss, and the other face of each radiating pad is in contact with the top of one corresponding heating component. The metal pipe shell comprises a pipe shell base and a pipe shell cover plate, wherein the pipe shell base and the pipe shell plate are packaged in an airtight mode through parallel
seam welding or
laser welding. According to the
integrated circuit packaging structure, packaging of the substrate with double-face
layout can be achieved, the integration degree of an
integrated circuit can be improved, good radiating can be achieved through the heating components on the double faces of the substrate, reliability of the circuit is guaranteed, an
impact-proof function is achieved, and the
processing process is simple.