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Halogen-free no-clean flux for tin wire core

A no-cleaning, flux technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of solder joint corrosion, excessive post-weld residues, insufficient electrical performance reliability, etc. Full and bright dots, good solderability and high reliability requirements

Inactive Publication Date: 2011-12-21
宁波喜汉锡焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to provide a halogen-free no-cleaning flux for tin wire cores to solve the excessive post-soldering residues in the existing fluxes and the insufficient reliability of electrical properties and solder joint corrosion caused by the existence of halogens. and other problems, while taking into account that new flux products can reduce the negative impact on the natural environment, production environment and occupational health

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Halogen-free no-cleaning flux for tin wire core, the weight percentage of each component is:

[0020] Stannous oxalate 3

[0021] Succinic acid 10

[0022] Itaconic acid 2

[0023] Fumaric Acid 2

[0024] Succinic anhydride 4

[0025] Diethylene glycol dimethyl ether 3

[0026] Hydrogenated rosin balance

[0027] Specific preparation method: Take the above-mentioned ingredients, add rosin in a reaction kettle with a stirrer, heat and control the temperature at 160°C, stir to make it completely dissolve, then add stannous oxalate, organic acid active agent, co-solvent, and stir until The solution is transparent and kept warm, pressed into the tin wire with an extruder, and finally drawn into solder wires of various specifications by a wire drawing machine.

[0028] The flux is tested with the Japanese Industrial Standard JISZ 3197-1999, the expansion rate is ≥85%, and the surface insulation resistance value S.I.R is ≥1×10 13 Ω, the copper mirror has no corrosion. ...

Embodiment 2

[0030] Halogen-free no-cleaning flux for tin wire core, the weight percentage of each component is:

[0031] Stannous oxalate 2

[0032] Methylsuccinic acid 5

[0033] Adipic acid 3

[0034] Malic acid 4

[0035] Hydrogenated rosin 20

[0036] Water white rosin balance

[0037] The preparation method is the same as in Example 1.

[0038] The flux is tested with the Japanese Industrial Standard JISZ 3197-1999, the expansion rate is ≥85%, and the surface insulation resistance value S.I.R is ≥1×10 13 Ω, the copper mirror has no corrosion.

Embodiment 3

[0040] Halogen-free no-cleaning flux for tin wire core, the weight percentage of each component is:

[0041] Stannous oxalate 1.5

[0042] Phthalic acid 5

[0043] Succinic anhydride 3

[0044] Azelaic acid 4

[0045] Diethylene glycol monomethyl ether 2

[0046] Ethylene glycol monobutyl ether 1

[0047] polymerized rosin balance

[0048] The preparation method is the same as in Example 1.

[0049] The flux is tested with the Japanese Industrial Standard JISZ 3197-1999, the expansion rate is ≥85%, and the surface insulation resistance value S.I.R is ≥1×10 13 Ω, the copper mirror has no corrosion.

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PUM

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Abstract

The invention relates to a no-halogen cleaning-free soldering flux for a tin wire core, which comprises the following components by mass percentage: 0.5-5 percent of tin oxalate, 0.5-25 percent of organic acid type activator and 0-3 percent of cosolvent, with the rest adopting rosin. Since the tin oxalate is used as an activator along with the organic acid type activators and no halogen is adopted, the soldering flux has good welding performance, no spattering and little smoke and odor can be caused during welding, the quantity of residues can be greatly decreased after welding, a plate surface is free from corrosion, welding points are full and bright, and the insulation resistance is high. The soldering flux is suitable for electronic precision welding with high reliability and solderability requirements.

Description

technical field [0001] The present invention relates to flux in electronic materials. Background technique [0002] Because some halogen-containing chemical substances have excellent soldering activity and low cost advantages, most of the fluxes used for manual or automatic soldering wire in the current electronics industry use halide-containing activators, but they are not enough The problem is: if the soldered electronic products continue to retain the activity of the above halogen-containing chemicals, the ion pollution will exceed the standard, and then chronic electrical leakage and corrosion will occur, shortening the life of electronic products, and even seriously affecting The reliability of electronic products, so in order to ensure product quality, many electronic manufacturers clean the electronic products after soldering with chemical cleaning agents. Although it is rare to use freons (CFCs) as cleaning solvents (the use of which has been banned by the United Na...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362B23K35/40
Inventor 朱岳恩丁建设
Owner 宁波喜汉锡焊料有限公司
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