Cassette transfer device and semiconductor device having the same

A transmission device and semiconductor technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, transportation and packaging, etc., can solve the problems of inconvenient transportation and placing of film boxes, inconvenience of taking out film boxes, inconvenient operation, etc., and achieve labor-saving retrieval. Putting the film box, saving time and effort in operation, and convenient operation

CN103594403BActive Publication Date: 2016-06-08BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2016-06-08

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Abstract

The invention discloses a wafer box transmission device, which comprises a wafer box, a cavity and a mobile platform, wherein the wafer box is used for placing a tray which bears a wafer, and the outer bottom surface of the wafer box is provided with a first guide member; the cavity is internally provided with a chamber used for accommodating the wafer box, and the bottom wall of the chamber is provided with a second guide member used for being matched with the first guide member; and the upper surface of the mobile platform is provided with a third guide member, the third guide member is used for being matched with the first guide member so as to support the wafer box on the mobile platform, and the mobile platform can move to a front opening of the chamber in order that the second guide member is abutted against the third guide member and that the wafer box can move in or out of the chamber along the second guide member and the third guide member. The wafer box transmission device disclosed by the invention can place and take the wafer box conveniently and efficiently. The invention further discloses a semiconductor device.
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Description

technical field

[0001] The invention relates to the field of semiconductor equipment, in particular to a chip box transmission device and semiconductor equipment with the same. Background technique

[0002] In the LED industry, generally multiple wafers to be processed are placed on a tray, the tray is placed in a cassette, and then the cassette containing multiple trays is placed in the transfer chamber for subsequent processes such as film transfer. Since multiple wafers are placed on the tray in the cassette, the cassette will be relatively heavy, which is particularly inconvenient when placing the cassette in the transmission cavity or taking it out from the transmission cavity. Currently, in the LED industry, Usually, the cassette is placed in the transmission cavity by hand, but because the cassette with the wafers is heavy, it is inconvenient for portable transportation and placement of the cassette, which is inconvenient to operate and inefficient. Contents of the ...

Examples

Embodiment Construction

[0029] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0030] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " The orientations or positional relationships indicated by "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise" are based on the attached The orientation or positional relationship shown in the figure is only for the convenience of describing the present invention and simplifying the description...