A multi-platform enclosure structure and construction method

An envelope structure and multi-platform technology, applied in infrastructure engineering, excavation, construction, etc., can solve the problems of poor water sealing effect of the envelope structure, unsuitable for foundation pit support, and the impact of the surrounding environment, so as to speed up the overall construction The effect of speed, ease of implementation, and high security

Active Publication Date: 2016-06-08
姚攀峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the support method for deep foundation pits is generally in the form of retaining piles plus support in the foundation pit and anchor rods. This form of support has high safety, but the site in the foundation pit is often relatively narrow, and the existence of the support in the foundation pit seriously affects The construction of the main structure has slowed down the construction progress; in addition, the deeper the foundation pit, the more complicated the surrounding soil conditions, and there are often some reinforcements that cannot be laterally stabilized by bolting. As the depth of the foundation pit increases, the pressure of groundwater increases, and the waterproofing in the foundation pit plays a decisive role in the safety and environmental impact of the foundation pit. It is easy to affect the surrounding environment, and is not suitable for foundation pit support in areas with high requirements on the construction environment, such as subways, roads, buildings, etc.

Method used

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  • A multi-platform enclosure structure and construction method
  • A multi-platform enclosure structure and construction method
  • A multi-platform enclosure structure and construction method

Examples

Experimental program
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Effect test

Embodiment 1

[0045] Embodiment one sees figure 1 , figure 2 and Figure 5 to Figure 12 As shown, a multi-platform enclosure structure is enclosed in the soil 9 around the foundation pit, including an outer enclosure, at least one inner enclosure and a tie device between the two, wherein the inner The enclosure device is low and located at the inner ring of the foundation pit, and the outer enclosure device is high and located at the outer ring of the foundation pit, forming a stepped shape with an outer high and an inner low;

[0046]The outer enclosure device includes continuous high enclosure components arranged in the front row, intermittent anti-side elevation piles 14 arranged in the rear row and connecting beams 17 arranged between the tops of the two, and the high enclosure components The cap beam 3 perpendicular to the connecting beam 17 is arranged on the top of the anti-side high pile 14; the inner layer enclosure device is the lower wall 21 of the underground diaphragm wall; ...

Embodiment 2

[0047] Embodiment two see image 3 , Figure 4 and Figure 5 to Figure 12 As shown, the difference from Embodiment 1 is that the inner enclosure device is a water-stop pile wall formed by layer-by-layer enclosure low piles 4 and water-stop piles B16 interlocking at intervals, and the enclosure low piles 4 and water-stop piles The top surface of B16 is tied through the cap beam 3.

[0048] The construction method of described multi-platform enclosure structure, steps are as follows:

[0049] Step 1, constructing a high enclosure component in the soil 9 around the foundation pit and pre-embedding the embedded part at the position of the platform to be set, and constructing the cap beam 3 on the top surface of the high enclosure component;

[0050] Step 2, constructing anti-side elevation piles 14 at intervals in a direction away from the foundation pit to be excavated, and constructing cap beams 3 on the top surface of anti-lateral elevation piles 14;

[0051] Step 3, constr...

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Abstract

A multi-platform enclosure structure, which is enclosed in the soil around the foundation pit, includes an outer enclosure, at least one inner enclosure and a tie device between the two, wherein the inner enclosure is low, Located on the inner ring of the foundation pit, the outer enclosure is high and located on the outer ring of the foundation pit, forming a stepped shape in the interior of the outer height; the outer enclosure is double-layered, and the inner enclosure is single-layer. In the present invention, by setting up multi-layer enclosure devices, the inner layer enclosure device forms internal support for the outer layer enclosure device while protecting the foundation pit, avoiding the setting of supports in the foundation pit, improving the safety of foundation pit construction, avoiding the The impact of foundation pit support on the construction of superstructures can serve multiple purposes. It provides a reliable and effective support structure and its construction method for the support of ultra-deep foundation pits. It can be widely used in large deep foundation pits, especially ultra-deep foundation pits. Support for deep foundation pits.

Description

technical field [0001] The invention relates to a foundation pit enclosure structure and a construction method thereof in building structure geotechnical engineering, in particular to a foundation pit enclosure structure without internal support and a construction method thereof. Background technique [0002] With the development of building construction technology, the application of ultra-deep foundation pits is becoming more and more extensive. How to support ultra-deep foundation pits reasonably and effectively is the technical core of foundation pit construction. At present, the support method for deep foundation pits is generally in the form of retaining piles plus support in the foundation pit and anchor rods. This form of support has high safety, but the site in the foundation pit is often relatively narrow, and the existence of the support in the foundation pit seriously affects The construction of the main structure has slowed down the construction progress; in add...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E02D17/04
Inventor 姚攀峰徐扬
Owner 姚攀峰
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