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A Torsional MEMS Resonator Device with Low Thermoelastic Damping Structure

An elastic damping and micro-electromechanical technology, applied in the direction of electrical components, impedance networks, etc., can solve problems such as incorrect

Active Publication Date: 2017-03-22
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the current practice of ignoring bending deformation is incorrect in many cases

Method used

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  • A Torsional MEMS Resonator Device with Low Thermoelastic Damping Structure
  • A Torsional MEMS Resonator Device with Low Thermoelastic Damping Structure
  • A Torsional MEMS Resonator Device with Low Thermoelastic Damping Structure

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Embodiment Construction

[0028] The present invention will be further described below in conjunction with the embodiments and the accompanying drawings.

[0029] The torsional MEMS resonant device with low thermoelastic damping structure of the present invention includes a base 4, a low thermoelastic damping structure arranged on the base 4, a driving electrode 5 and a sensing electrode 6, and a twisted flat plate 1 supported by a low thermoelastic damping structure. The low thermoelastic damping structure includes a first torsion support beam 2 and a second torsion support beam 3 with a rectangular cross section located on the same axis. The torsion plate 1 can rotate around the torsion axis formed by the coaxial first torsion support beam 2 and the second torsion support beam 3 . The driving electrodes 5 and the sensing electrodes 6 are symmetrically arranged on both sides of the axis of the low thermoelastic damping structure, that is, symmetrically arranged on both sides of the torsion axis formed...

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Abstract

The invention discloses a torsional microcomputer electric resonance device with a low thermal elastic damping structure. The device comprises a substrate, the low thermal elastic damping structure which is arranged on the substrate, a drive electrode, an inductive electrode, and a torsional flat plate which is supported by the low thermal elastic damping structure. The low thermal elastic damping structure comprises a first torsional support beam and a second torsional support beam, wherein the first torsional support beam and the second torsional support beam are located on the same axis and have rectangular cross sections. The torsional flat plate can rotate around the axis on which the first torsional support beam and the second torsional support beam are located. The drive electrode and the inductive electrode are symmetrically arranged on both sides of the axis of the low thermal elastic damping structure. The long sides of the rectangular cross sections of the first torsional support beam and the second torsional support beam are perpendicular to the substrate. According to the invention, the long sides of the cross sections of the torsional support beams are perpendicular to the substrate plane; generated thermal elastic damping is shorter than the thermal elastic damping generated when the long sides are horizontally placed; and especially in high frequency, the thermal elastic damping is obviously decreased.

Description

technical field [0001] The invention belongs to the field of MEMS, and relates to a torsional micro-electromechanical resonant device with a low thermoelastic damping structure. Background technique [0002] The quality factor is an important performance index of a resonant device. For devices encapsulated in vacuum, thermoelastic damping is one of the important factors affecting the quality factor. Thermoelastic damping is due to the compression and stretching of the mechanical structure under the action of stress, which causes the volume to change, resulting in heat generation and dissipation, that is, the vibration energy of the resonant device becomes heat energy and dissipates. For torsional resonant devices, the current general view is that the results of elastic mechanics show that [S.A.Chandorkar, R.N.Candler, A.Duwel, R.Melamud, M.Agarwal, K.E.Goodson, T.W.Kenny, Multimodethermoelastic dissipation, Journal of Applied Physics, 105(2009)043505.], torsional deformati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H9/24
Inventor 李普方玉明台永鹏
Owner SOUTHEAST UNIV
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