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Blocking device and mezzanine card combination

A flow-blocking device and interlayer technology, which is applied in the field of flow-blocking devices and interlayer card combinations, can solve the problems of high air flow temperature of the interlayer card, increase the calorific value of the interlayer card, and increase the difficulty of heat dissipation of the interlayer card, so as to improve the heat dissipation efficiency and facilitate production The effect of line assembly

Active Publication Date: 2017-05-24
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method greatly increases the calorific value of the mezzanine card and increases the difficulty of heat dissipation of the mezzanine card
At the same time, before passing through the mezzanine card, the heat dissipation air in the blade server usually goes through the preheating of the CPU cooling device first, so that the temperature of the air flow for cooling the mezzanine card is relatively high.
Therefore, if there is no air guide structure in the blade server to guide the cooling air flow to the main heat-generating position of the mezzanine card, the mezzanine card will not be able to effectively dissipate heat

Method used

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  • Blocking device and mezzanine card combination
  • Blocking device and mezzanine card combination
  • Blocking device and mezzanine card combination

Examples

Experimental program
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Embodiment Construction

[0029] A number of embodiments of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some known and conventional structures and elements will be shown in a simple and schematic manner in the drawings.

[0030] Please refer to Figure 1A as well as Figure 1B . Figure 1A It is a partial side view illustrating the combination of a mezzanine card assembled into a casing 10 of a computer system (not shown) according to an embodiment of the present invention, wherein the casing 10 is shown in cross-section, and the second mezzanine card 16 has not been arranged in the casing body 10. Figure 1B f...

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PUM

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Abstract

The invention discloses a flow choking device and an interlayer clamp combination. The interlayer clamp is applied to a computer system comprising a shell, and comprises an interlayer clamp and the flow choking device, the interlayer clamp is detachably arranged in the shell and comprises a circuit board which is separately positioned above a base board of the shell, the flow choking device comprises an engaging member, a flow choking board and an elastic member, the engaging member is used for being engaged with the circuit board, the flow choking board is pivoted to the engaging member to rotate between a folding position and an unfolding position relatively to the engaging member, the elastic member is compressed between the engaging member and the flow choking board to enable the flow choking board to rotate towards the unfolding positon, and the flow choking board which rotates to the unfolding position blocks a passage between the circuit board and the base board.

Description

technical field [0001] The present invention relates to a combination of a flow blocking device and a sandwich card, in particular to a combination of a flow blocking device and a combination of a sandwich card used in a computer system. Background technique [0002] In recent years, in order to maximize economic benefits, the market has been pursuing high-efficiency servers. In order to improve the processing capacity of the server as much as possible in the limited space in the server, the density of electronic components inside the server is constantly increasing, and the burden of heat dissipation is constantly increasing. [0003] As we all know, in the blade server, the space between every two "blades" is very narrow, and the mezzanine card (mezzanine card, such as an expansion graphics card) on the motherboard of each "blade" can only be parallel to the host computer. board settings. In order to reasonably and effectively utilize the area of ​​the mezzanine card and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18
Inventor 时明鸿
Owner INVENTEC PUDONG TECH CORPOARTION
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