Die Ejector
A discharge device and bare core technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of reduced operating rate of bare core bonding facilities
Active Publication Date: 2016-09-14
SEMES CO LTD
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Problems solved by technology
[0005] On the other hand, when replacing the ejection unit and carrier to correspond to the size of the die, since a considerable amount of time is spent on aligning the rotation angle and the center of the ejection unit and carrier, the die bonding facility of the die ejector is used The operating rate of the
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[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below, and thus can be embodied in various forms. The following embodiments are provided to enable those skilled in the art to fully understand the scope of the present invention, not to complete the present invention perfectly.
[0029] When it is described that an element is disposed on or connected to another element or layer, the element may be directly disposed on or directly connected to the other element and the other element or layer may be disposed therebetween. Differently, when it is described that an element is directly disposed on or directly connected to another element, there are no other elements interposed therebetween. To describe various elements, components, regions, layers, and / or sections, the terms first, second, third, etc. may be used. However, the ...
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The invention provides a bare core removing device. The device comprises a workbench, a bare core removing apparatus, a carriage holding unit and a carriage transmitting unit. The workbench is configured to support a cutting belt, and multiple bare cores are adhered to the cutting belt. The bare core removing apparatus includes removing units, a main body and carriages. The removing units are arranged under the workbench and are configured to selectively lift one of the bare cores. The main body has a driving unit configured to be a vertical mobile removing unit. The removing units are arranged inside the carriages each of which has a lower opening to allow the top of the main body to be inserted into the carriages. The carriage holding unit is disposed at one side of the workbench. The carriages with the removing units inside are accommodated in the carriage holding unit. The carriage transmitting unit is configured between the bare core removing apparatus and the carriage holding unit to transmit the carriages, so one of the carriages accommodated in the carriage holding unit replaces another carriage.
Description
technical field [0001] Embodiments of the present invention relate to a die ejection device, and more particularly, to a device for separating a die including a semiconductor device from a wafer and bonding the die to a substrate during a semiconductor manufacturing process. Bare die ejection device. Background technique [0002] Generally, a semiconductor device can be formed on a silicon wafer serving as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The semiconductor devices formed as described above can be separated by a dicing process and can be bonded to a substrate by a bonding process. [0003] The device for performing the die bonding process may include a pick-up module and a bonding module, the pick-up module picks up and separates the die from a wafer (separated into die including semiconductor devices), and the bond module picks up the die The core is attached to the substrate. The pick module may include a stage unit ...
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IPC IPC(8): H01L21/67
Inventor 方镐千李喜澈林锡泽崔玹玉
Owner SEMES CO LTD