High-density multilayer substrate surface symmetric structure and manufacturing method

Abstract

The invention relates to a novel high-intensity high-performance multilayer substrate surface symmetrical structure and a manufacturing method. The structure comprises a first circuit layer (1), a second circuit layer (2), a third circuit layer (3), a fourth circuit layer (4), a first connecting copper column (5), a second connecting copper column (6) and a third connecting copper column (7), wherein the first circuit layer (1), the second circuit layer (2), the third circuit layer (3) and the fourth circuit layer (4) are sequentially arranged from top to bottom. An insulating photosensitive material (10) is wrapped on the surface and the periphery of the first circuit layer (1) and the surface and the periphery of the fourth circuit layer (4). A chip installation area (11) is formed in the portion, on the front face of the first circuit layer (1), of the insulating photosensitive material (10), and a ball plantation area (12) is formed in the portion, on the back face of the fourth circuit layer (4), of the insulating photosensitive material (10). According to the novel high-intensity high-performance multilayer substrate surface symmetrical structure and the manufacturing method, safety and reliability of a packaging body are improved, environment pollution caused by glass fiber materials is reduced, and design and manufacturing of the high-intensity circuit are truly achieved.

Description

technical field [0001] The invention relates to a surface symmetrical structure of a high-density multilayer substrate and a manufacturing method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] The current high-density substrate packaging structure such as Figure 33 As shown, the manufacturing process is mainly to form a multi-layer circuit board by drilling through holes and using integrated materials on the basis of the glass fiber core material. The holes between the circuit layers are opened by laser drilling blind holes, and then plated. The holes complete the electrical connection. [0003] The above-mentioned high-density substrate packaging structure has the following deficiencies and defects: [0004] 1. The central core board material is composed of resin material and glass fiber cloth material. Since the glass fiber cloth itself is a foaming material, it is easy to absorb moisture and moisture due to the storag...

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