A planar magnetron sputtering target

Abstract

The invention discloses a planar magnetron sputtering target, which is composed of a flange, a pressing sleeve, a water cylinder, an excitation coil, an electrical pure iron sleeve, an insulating sleeve, a water nozzle, a pressure plate, a set screw, an electrical pure iron pressure rod, a sealing ring, a gasket, an insulating cover, a pressing ring, bolts, an insulating spacer sleeve, a shielding cover, slotted countersunk head screws, a compressing ring, a neodymium iron boron permanent magnet column, and a positioning bracket part. The planar magnetron sputtering target is unique in shielding cover design, structural arrangement of the excitation coil, electrical pure iron sleeve and permanent magnet, magnetic field adjustability of the magnetron sputtering target, cooling structure design and other aspects, solves the common defects of point discharge, low sputtering rate on magnetic materials, complex cooling structure and the like frequently encountered by magnetron sputtering targets, and improves the target material utilization rate. The planar magnetron sputtering target provided by the invention has the characteristics of simple structure, stable and reliable work, large magnetic field adjustable range, high sputtering efficiency, convenient maintenance and low cost, and can be widely applied to vacuum magnetron sputtering coating equipment.

Description

Technical field

[0001] The invention provides a planar magnetron sputtering target, which belongs to the technical field of vacuum sputtering coating. Background technique

[0002] Magnetron sputtering is an important coating technology in the field of vacuum coating. It has the advantages of low temperature, fast speed, low energy consumption, a wide range of applicable substrates and coating materials, dense coating, high smoothness, and good bonding force. Magnetron sputtering coating is mainly based on the Penning discharge principle. By applying a magnetic field in the discharge space, the charged particles (electrons, ions) are bound in the discharge space, which increases the ionization rate of the charged particles to the neutral atoms (molecules) and makes The gas pressure and voltage required for glow discharge are reduced, and the magnetic field on the surface of the target confines the secondary electrons on the surface of the target, increasing the bombardment of the...

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