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Back-drilling method

A back-drilling and back-drilling technology, used in electrical components, printed circuit manufacturing, printed circuits, etc., can solve problems such as uneven board thickness

Active Publication Date: 2015-11-11
WUS PRINTED CIRCUIT (KUNSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the deficiencies of the prior art, the object of the present invention is to provide a back drilling method, which can overcome the problems of plate warping, plate bending and uneven plate thickness, and realize the requirements of high precision back drilling

Method used

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Embodiment Construction

[0029] The present invention will be specifically introduced below in conjunction with the accompanying drawings and specific embodiments.

[0030] A kind of back drilling method, comprises the steps:

[0031] Step 1: Clean the table of the working back drilling rig to ensure that there are no sundries on the table to prevent the influence of the measured plate thickness data; at the same time, correct the parameters of the back drilling rig; as an optimization, the back drilling and back drilling rig use Schmoll back drilling Back Drill Stand (MXY5 / 6-160-XXL-CCD)

[0032] Step two: if figure 2 As shown, place the PCB board on the table, measure the position height of each back-drilled hole except the back-drilled surface, and obtain the data (H1); that is, the height of the drill from zero to the board surface, it should be noted that the measurement Use the normal drilling program to operate, but the drilling program at this time needs to be mirrored;

[0033] Step three...

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Abstract

The present invention discloses a back-drilling method. According to the method, the plate thickness of each actual back-drilling hole position is measured, more accurate plate thickness data is obtained through the mode of taking a minimum value after two-side measurement, the problems of plate warpage, bending, and uneven plate thickness are overcome, and thus the requirement of high precision back drilling is realized.

Description

technical field [0001] A method of drilling, especially a method of backdrilling. Background technique [0002] Under the background of the rapid development of the communication industry, as the basis for supporting this industry, the requirements for high-speed and high-frequency PCB boards are getting higher and higher. As a key process of PCB boards, especially high-speed PCB boards, back drilling can remove excess hole copper above the signal layer in metallized holes and reduce signal loss during transmission, so the accuracy of back drilling can be improved to meet the requirements of different PCB boards It is also more important. [0003] The existing technology only considers the uniformity of board thickness and adopts matrix measurement. Due to the diversity of design of the actual PCB board, the circuit board not only has uneven board thickness but also board bending during the manufacturing process. And the problem of plate warping, which leads to inaccurate ...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0047
Inventor 雷川秦仪符政新
Owner WUS PRINTED CIRCUIT (KUNSHAN) CO LTD