Tin plating solution and preparation method thereof

A technology of tin plating solution and tin methanesulfonate, applied in the field of tin plating solution and preparation thereof, can solve the problems of small plating solution process range, high electroplating production cost, slow speed, etc., and achieves reduction of electroplating cost and improvement of plating speed , the effect of a wide range of applications

Active Publication Date: 2016-04-27
GUANGZHOU JINGLI SURFACE TREATMENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the current tin plating solution has a pH value of 2-4 and is slightly acidic. It is easy to diffuse during high-current electroplating. The plating solution must be frozen to 20-28°C for use. The current is ...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Example 1 Tin plating solution weight percentage formula: sodium gluconate 30%, potassium methanesulfonate or ammonium methanesulfonate 0.3%%, sodium citrate 0.1%%, sodium tartrate 0.1%%, dodecyl dimethyl 0.03% benzyl ammonium chloride, 0.1% ammonia water, 0.2% tin methanesulfonate, and the balance is water.

[0014] Preparation method: Add sodium gluconate or potassium gluconate, potassium methanesulfonate or ammonium methanesulfonate, sodium citrate, sodium tartrate into water together, dissolve at 30°C, and then add dodecyldimethylbenzyl in sequence ammonium chloride, tin methanesulfonate, and ammonia water, and mix well.

Embodiment 2

[0015] Example 2 Tin plating solution weight percentage formula: sodium gluconate or potassium gluconate 30%, potassium methanesulfonate or ammonium methanesulfonate 10%, sodium citrate 10%, sodium tartrate 10%, dodecyl disulfonate Methyl benzyl ammonium chloride 3%, ammonia water 10% and tin methanesulfonate 2.5%.

[0016] Preparation method: Add sodium gluconate or potassium gluconate, potassium methanesulfonate or ammonium methanesulfonate, sodium citrate, sodium tartrate into water together, dissolve at 30°C, and then add dodecyldimethylbenzyl in sequence ammonium chloride, tin methanesulfonate, and ammonia water, and mix well.

Embodiment 3

[0017] Example 3 Tin plating solution weight percentage formula: sodium gluconate or potassium gluconate 2%, potassium methanesulfonate or ammonium methanesulfonate 10%, sodium citrate 10%, sodium tartrate 10%, dodecyl di Methyl benzyl ammonium chloride 3%, ammonia water 10% and tin methanesulfonate 2.5%.

[0018] Preparation method: Add sodium gluconate or potassium gluconate, potassium methanesulfonate or ammonium methanesulfonate, sodium citrate, sodium tartrate into water together, dissolve at 30°C, and then add dodecyldimethylbenzyl in sequence ammonium chloride, tin methanesulfonate, and ammonia water, and mix well.

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PUM

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Abstract

The invention relates to the technical field of electroplating and particularly discloses a tin plating solution and a preparation method thereof. The tin plating solution contains the following components: sodium gluconate or potassium gluconate, potassium methanesulfonate or ammonium methanesulfonate, sodium citrate, sodium tartrate, dodecyl dimethyl benzyl ammonium chloride, ammonia water and tin methanesulfonate. Compared with the existing tin plating solution, the tin plating solution can be used for electroplating production at the temperature of 25-35 DEG C, can be used for electroplating a non-acidic solution, is very wide in application range and can be used for increasing the current by 100% and increasing the plating speed by 100% during electroplating and reducing the electroplating cost by 20%.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a tin plating solution and a preparation method thereof. Background technique [0002] Tin plating solution is a special liquid used in the tin plating industry. It can be used for tin plating on the surface of the alloy. The tin plating is bright and silvery white, which can increase the weldability and decoration of the metal without affecting the conductivity. It can be used in the electronics industry. Furniture utensils, food packaging, etc. [0003] However, the current tin plating solution has a pH value of 2-4, is slightly acidic, and is easy to diffuse during high-current electroplating. The plating solution must be frozen to 20-28°C for use. Therefore, the use of existing tin-plating solutions is limited, which further leads to high electroplating production costs. Contents of the invention [0004] The technical problem to be solved by the present invention ...

Claims

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Application Information

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IPC IPC(8): C25D3/32
CPCC25D3/32
Inventor 朱路方
Owner GUANGZHOU JINGLI SURFACE TREATMENT TECH CO LTD
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