Electronic component conveying nozzle and electronic component mounting device having the same

Abstract

The invention provides an electronic component conveying suction nozzle and an electronic component mounting device with the same. The electronic component conveying suction nozzle can keep and convey the electronic component which is kept through suction or clamping and has a shape that is relatively difficult to keep. The suction nozzle is provided with the components of a base part which is connected with a loading head of an electronic component mounting device; a guiding shaft which is connected with the side surface of the base part; a sliding part which is connected with the guiding shaft and can move relative to the base part; an arm part which is fixed with the sliding part and is provided with a front end part that contacts with a connector type electronic component at the part that is farest from the sliding part; and a telescopic adjusting mechanism which is configured between the base part and the sliding part and makes the sliding part move relative to the base part so that the distance between the base part and the front end part changes. The front end part is inserted into a trough formed on one surface, which faces the central side, of the connector type electronic component. A force is applied on the arm in a direction to the surface, which faces the central side, of the electronic component, thereby keeping the connector type electronic component.

Description

technical field [0001] The present invention relates to an electronic component transport suction nozzle for transporting electronic components, and an electronic component mounting apparatus having the electronic component transport suction nozzle and mounting electronic components on a substrate. Background technique [0002] The electronic component mounting apparatus repeatedly holds the electronic component by the suction nozzle provided on the mounting head and mounts the electronic component on the mounting point of the substrate, thereby mounting the electronic component on the substrate. In recent years, there have been proposed electronic component mounting apparatuses capable of mounting, in addition to mounted electronic components mounted on a substrate, plug-in electronic components having leads that are inserted into holes in the substrate. inserted and mounted on a substrate (refer to Patent Document 1). [0003] In addition, Patent Document 1 describes a su...

AI Technical Summary

Problems solved by technology

These above-mentioned connector-type electronic parts having an insertion part are formed with an insertion part for inserting various parts, and since it is a structure in which a member of a plate-shaped part is inserted, it is a shape extending in one direction, so there is a possibility of Electronic components that maintain difficult shapes

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