A kind of flexible circuit board and its display

A technology of flexible circuit boards and flexible circuit substrates, which is applied in the direction of flexible printed circuit boards, printed circuits, printed circuits connected with non-printed electrical components, etc., can solve the problems of FPC thickness, reduce the overall thickness, Save installation space and improve space utilization

Active Publication Date: 2019-04-23
SHANGHAI AVIC OPTOELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the thickness of the FPC base material is determined, and the height of its surface-mounted components is also determined, resulting in a thicker thickness of the entire FPC, so there are certain limitations

Method used

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  • A kind of flexible circuit board and its display
  • A kind of flexible circuit board and its display

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Such as figure 1 as shown, figure 1 It is a cross-sectional view of the flexible circuit board of Embodiment 1. The flexible circuit board 100 of Embodiment 1 includes a first insulating protection layer 10 and a second insulating protection layer 20 stacked oppositely, and is stacked between the first insulating protection layer 10 and the second insulating protection layer 20. The flexible circuit substrate 30 between the second insulating and protective layers 20 , and the components S1 , S2 , S3 electrically connected to the flexible circuit substrate 30 .

[0018] The flexible circuit substrate 30 includes at least one flexible substrate layer and at least two conductive layers.

[0019] In this embodiment, the flexible circuit substrate 30 includes a first flexible substrate unit 30a, the first flexible substrate unit 30a includes n layers of flexible substrate layers 31 and (n+1) layers of conductive layers 32, 33, and has a flexible substrate The structure in ...

Embodiment 2

[0042] Such as figure 2 As shown, the flexible circuit board 100' of Embodiment 2 includes a first insulating protection layer 10' and a second insulating protection layer 20' that are stacked oppositely, and is stacked on the first insulating protection layer 10' and the second insulating protection layer. The flexible circuit substrate 30' between the layers 20', and the components S1', S2' electrically connected to the flexible circuit substrate 30'.

[0043] The flexible circuit substrate 30' includes two first flexible substrate units: a first flexible substrate unit 30a' at a shallower position and a first flexible substrate unit 30b' at a deeper position, with an insulating layer 30c interposed between them. ' separated.

[0044] The two first flexible substrate units 30a', 30b' are formed by covering the upper and lower sides of a flexible substrate layer with a conductive layer, which is the same as the first flexible substrate unit 30a in Embodiment 1, specifically...

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Abstract

The invention provides a flexible circuit board and a displayer adopting the flexible circuit board. According to the flexible circuit board, installation holes for installing components run into the inner portion of the flexible circuit board. Compared with the prior art, the depth of each installation hole is deeper, so that the installation holes can accommodate the components better, the overall thickness of the flexible circuit board can be reduced, installation space is saved, space utilization rate of the product is improved, and design requirement for smaller or higher-density installation can be met.

Description

technical field [0001] The invention relates to the display field, in particular to a flexible circuit board and a display including the flexible circuit board. Background technique [0002] Flexible circuit board is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film, referred to as soft board or FPC (Flexible Printed Circuit), with wiring density High, thin thickness and other characteristics, mainly used in many products such as mobile phones, notebook computers, PDAs, digital cameras and liquid crystal display modules. [0003] The components on the existing FPC are generally installed by surface mount method. By etching from the insulating protective layer on one side until the upper surface of the upper conductive layer is exposed, the lower surface of the component is connected to the upper surface of the upper conductive layer. The electrical connection realizes the placement of components. [0004] However, the thickn...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18
CPCH05K1/183H05K2201/05
Inventor 吴茂棒朱志峰黄正园汤仁波王善荣李文静
Owner SHANGHAI AVIC OPTOELECTRONICS
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