High-precision thin film circuit board production line

Abstract

The invention relates to the technical field of automatic production equipment of thin film circuit boards, in particular to a high-precision thin film circuit board production line. The high-precision thin film circuit board production line comprises a coil preshrinking furnace, a pre-positioning lamination device and a hot roll-press device, wherein the coil preshrinking furnace is used for carrying out preshrinking on the coil; the pre-positioning lamination device is used for carrying out loading and pre-positioning lamination on the coil; the hot roll-press device is used for carrying out hot roll-press on the laminated coil; the coil preshrinking furnace, the pre-positioning lamination device and the hot roll-press device are sequentially connected with one another; the coil sequentially passes through coil preshrinking furnace, the pre-positioning lamination device and the hot roll-press device; the coil which passes through the coil preshrinking furnace in advance can ensure shrinkage of a product subjected to hot roll-press procedure; the pre-positioning lamination device accurately laminates a film sheet on the coil and achieves pre-positioning before lamination; the lamination and registration accuracy is improved when automatic lamination of the product is achieved; and the hot roll-press device carries out hot-press lamination on a multi-layer film material to form the high-precision thin film circuit board. The thin film circuit board can achieve automatic production, ensures the lamination accuracy, improves the yield and saves the production cost of an enterprise.

Description

technical field [0001] The invention relates to the technical field of thin film circuit board automatic production equipment, in particular to a high-precision thin film circuit board production line. Background technique [0002] In the field of thin film circuit board production, it involves multi-process collaborative operations. At present, it is difficult for equipment to meet the requirements of automatic production, and its production is generally carried out independently in multiple processes. There are many defects in this production process: 1. On the automatic lamination equipment, since it does not have the function of pre-positioning, it is easy to produce offset during the rolling lamination process, resulting in a greatly reduced lamination accuracy , Increase the defect rate of the product. 2. In the process of hot rolling and laminating, the coil material will often shrink after being heated and cooled. The shrinkage of the film material will cause the ci...

AI Technical Summary

Problems solved by technology

[0002] In the field of thin film circuit board production, it involves multi-process collaborative operations. At present, it is difficult for equipment to meet the requirements of automatic production. Its production is generally carried out independently in multiple processes.

There are many defects in this production process: 1. On the automatic lamination equipment, since it does not have the function of pre-positioning, it is easy to produce offset during the rolling lamination process, resulting in a greatly reduced lamination accuracy , increasing the defect rate of the product

2. In the process of hot rolling and laminating, the coil material tends to shrink after being heated and cooled. The shrinkage of the film material will cause the circuit inside the film circuit board to be misaligned, resulting in an increase in the defective rate of the product

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