Double ellipsoid combination lens and its design method, packaging structure with primary optics

Abstract

The invention discloses a double ellipsoidal composite lens in a left and right symmetrical structure. The left structure and the right structure are cut by an ellipsoid. The long axis of the left ellipsoid corresponding to the left structure intersects the long axis of the right ellipsoid corresponding to the right structure, wherein the intersection angle is between 8 degrees to 100 degrees. The distance between the center of the left ellipsoid and the right ellipsoid is between 0.4mm and 0.6mm. The bottom of the double ellipsoidal composite lens is located on the plane where the center of the left ellipsoid and the center of the right ellipsoid are located. The invention further discloses a package structure with the double ellipsoidal composite lens and primary optics. Compared with a traditional primary optical lens, the composite lens has smaller size, the advantages of chip size package and higher uniformity. A reflective layer is designed, so that an element can maintain high light efficiency. A new research and application direction is provided for the primary optics design of chip size package.

Description

technical field [0001] The invention relates to a primary optical element of an LED chip, in particular to a double ellipsoid combination lens and a design method thereof, and a packaging structure with primary optics. Background technique [0002] As a new generation of solid-state lighting source, LED has developed rapidly in recent years and created huge social and economic benefits. With the development of LED lighting technology, the market has put forward requirements for LEDs with smaller size, better light efficiency and light energy distribution. In addition to the advantages of high light output efficiency, good stability, low thermal resistance, and good flexibility, the LED chip size package (CSP) technology that has emerged in recent years provides the possibility to realize the miniaturization of LED devices. Among them, the field of direct backlight is one of the main application fields of CSP packaging. Due to the lack of optical design of the current CSP p...

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