Display apparatus

Abstract

The invention discloses a display apparatus including a display panel. The display panel includes a first substrate and a second substrate that are opposed. The second substrate has a first surface, the first surface comprises a first plane and a first inclined surface that are connected to each other, the first plane is provided with a patterned conductive layer, the patterned conductive layer extends from the first plane to the first inclined surface so as to form a plurality of pads on the first inclined surface. The first surface of the second substrate comprises the first plane and the first inclined surface that are connected to each other, the patterned conductive layer of the first plane extends to the first inclined surface to form the plurality of pads, the pads are arranged on the inclined surface and occupy less right side area of the substrate, so that the demand of narrow frames is met; and moreover, the pads and the patterned conductive layer can be manufactured simultaneously, so that the requirements of pad size and density can be met. Compared with the prior art, the pads provided have the advantages of convenient manufacturing, stable performance and good pressing effect.

Description

technical field [0001] The present invention relates to a display device, in particular to a display device which is advantageous for a narrow frame. Background technique [0002] Liquid Crystal Display (LCD, Liquid Crystal Display) has many advantages such as thin body, power saving, and no radiation, and has been widely used. High resolution, high brightness, wide viewing angle, low power consumption and other performances, and the corresponding technologies are also continuously being developed. [0003] Please refer to figure 1 , figure 1 It is a partial cross-sectional view of a display device in the prior art. The display device 1000' includes a first substrate 100' and a second substrate 200' disposed opposite to each other. A plurality of welding pads 300' are disposed on the upper surface of the second substrate 200', and the flexible circuit board 400' is pressed onto the plurality of welding pads 300'. Since the front side of the flexible circuit board 400' i...

AI Technical Summary

Problems solved by technology

This method is difficult to manufacture, and the pads 300" cannot be densely distributed, which affects the effect of lamination with the flexible circuit board 400".

And because a plurality of pads 300" are arranged on the sides of the first substrate 100" and the second substrate 200", it is necessary to extend the lines on the surface of the substrate (such as the upper surface of the first substrate 100") to the side of the substrate, so that First, there is a problem of line breakage at the bend between the substrate surface and the side of the substrate

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