A method for epitaxially growing iron nitride thin films with multiple phase structures on mgo(111) substrates
An epitaxial growth, epitaxial thin film technology, applied in metal material coating process, vacuum evaporation coating, coating and other directions, can solve the limitation, continuous control of thin film has not been well solved, complex hexagonal structure and metastable characteristics, etc. problems, to achieve the effect of expanding the application space
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Embodiment 1
[0030] Preparation of α-Fe and γ'-Fe on MgO(111) Substrates 4 An epitaxial thin film with N two-phase structure coexisting, comprising the following steps:
[0031] (1) Fix the Fe target with a purity of 99.99% from Hefei Kejing Co., Ltd. on the strong magnetic target in the sputtering chamber;
[0032] (2) Fix the single crystal MgO(111) substrate and glass with a size of 5×5×0.5mm on the substrate holder at the same time, put them into the sputtering chamber, and vacuumize;
[0033] (3) The vacuum degree of the sputtering chamber reaches 1.2×10 -4 Pa, heat the substrate support up to 350°C;
[0034] (4) Passing Ar and N 2 The mixed gas, wherein, the Ar gas flow is 49sccm, N 2 The gas flow rate is 1 sccm, and the air pressure in the sputtering chamber is stabilized by adjusting the bypass valve of the molecular pump;
[0035] (5) The air pressure in the sputtering chamber is stabilized at 0.2Pa, the sputtering current is adjusted to 0.08mA, the pre-sputtering is 5 minute...
Embodiment 2
[0039] Preparation of γ'-Fe on MgO(111) Substrate 4 N epitaxial thin film, comprises the steps:
[0040] (1) Fix the Fe target with a purity of 99.99% from Hefei Kejing Co., Ltd. on the strong magnetic target in the sputtering chamber;
[0041] (2) Fix the single crystal MgO(111) substrate and glass with a size of 5×5×0.5mm on the substrate holder at the same time, put them into the sputtering chamber, and vacuumize;
[0042] (3) The vacuum degree of the sputtering chamber reaches 1.2×10 -4 Pa, heat the substrate support up to 350°C;
[0043] (4) Passing Ar and N 2 The mixed gas, wherein, the Ar gas flow is 46sccm, N 2 The gas flow rate is 4 sccm, and the air pressure in the sputtering chamber is stabilized by adjusting the side pumping valve of the molecular pump;
[0044] (5) The air pressure in the sputtering chamber is stabilized at 0.2Pa, the sputtering current is adjusted to 0.08mA, the pre-sputtering is 5 minutes, and the growth sputtering is 30 minutes;
[0045] ...
Embodiment 3
[0048] Preparation of γ'-Fe on MgO(111) Substrate 4 N and ε-Fe 3-x An epitaxial thin film with N(0≤x<1) two-phase structure coexisting, including the following steps:
[0049] (1) Fix the Fe target with a purity of 99.99% from Hefei Kejing Co., Ltd. on the strong magnetic target in the sputtering chamber;
[0050] (2) Fix the single crystal MgO(111) substrate and glass with a size of 5×5×0.5mm on the substrate holder at the same time, put them into the sputtering chamber, and vacuumize;
[0051] (3) The vacuum degree of the sputtering chamber reaches 1.2×10 -4 Pa, heat the substrate support up to 350°C;
[0052] (4) Passing Ar and N 2 The mixed gas, wherein, the Ar gas flow is 45sccm, N 2 The gas flow rate is 5 sccm, and the air pressure in the sputtering chamber is stabilized by adjusting the side pumping valve of the molecular pump;
[0053] (5) The air pressure in the sputtering chamber is stable at 0.2Pa, adjust the sputtering current to 0.08mA, pre-sputter for 5 min...
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