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An electroless plating device

The technology of an electroless plating device and filtering device, which is applied in the field of electroless plating, can solve problems such as drying treatment of items that cannot be plated, ineffective and uniform electroless plating, and inability to guarantee the effect of electroless plating, so as to achieve uniform and all-round plating. Effect

Inactive Publication Date: 2018-10-19
QILU INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The existing electroless plating device can only be stirred simply by a stirring device, and cannot effectively and evenly perform electroless plating. The effect of electroless plating cannot be guaranteed due to liquids such as moisture in the article; the existing electroless plating device cannot filter the waste liquid after plating, and the waste liquid is easy to cause damage to the environment

Method used

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  • An electroless plating device
  • An electroless plating device
  • An electroless plating device

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Embodiment Construction

[0014] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0015] An electroless plating device, comprising a platform 1, a waste liquid filtering device 2 is fixedly installed on one side of the top surface of the platform 1, a rotating motor 7 is fixedly installed on the other side of the top surface of the platform 1, the output shaft of the rotating motor 7 faces upward, and the waste liquid filtering ...

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Abstract

An electroless plating device, comprising a platform, a waste liquid filtering device is fixedly installed on one side of the top surface of the platform, a rotating motor is fixedly installed on the other side of the top surface of the platform, the output shaft of the rotating motor faces upward, and the waste liquid filtering device consists of a filtering device main body, a waste It consists of a liquid absorption pump, a sediment cleaning box with an opening on the top, a waste liquid inlet, and a waste liquid outlet. The waste liquid inlet is located on one side of the main body of the filter device and faces the rotating motor, and the waste liquid outlet is located on the other side of the main body of the filter device. The main body of the small filter device The control device is fixedly installed on the surface of the front end, the waste liquid absorption pump is electrically connected to the control device, the belt transport device is fixedly installed on the top of the waste liquid filter device, a suspension shelf is arranged above the waste liquid filter device, and the bottom of the support frame is fixed to the top of the main body of the waste liquid filter device connection, a drying heating element is fixedly installed on the bottom surface of the hook plate, a stirring device is arranged above the rotating motor, and the ultrasonic vibrator, the high-pressure bubble injector, and the rotating motor are respectively electrically connected to the control device.

Description

technical field [0001] The invention relates to the field of electroless plating, in particular to an electroless plating device. Background technique [0002] Electroless plating, also known as electroless plating or self-catalytic plating, is a plating method that reduces metal ions in the plating solution to metal and deposits them on the surface of parts with the help of a suitable reducing agent without an external current. Electroless plating The technology is a process of metal deposition through a controllable oxidation-reduction reaction under the catalysis of metals. Compared with electroplating, electroless plating technology has the advantages of uniform coating, small pinholes, no need for DC power supply equipment, and deposition on non-conductors. And have some special properties and other characteristics. In addition, due to less waste discharge, less environmental pollution and lower cost, electroless plating technology has gradually replaced electroplating...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/16
CPCC23C18/1617C23C18/1669
Inventor 岳磊
Owner QILU INST OF TECH