Independent electroplating device and process for metal workpiece

Abstract

The invention discloses an independent electroplating device for a metal workpiece. The device comprises an electroplating cavity, wherein an outlet through which the metal workpiece can pass is formed in the top of the electroplating cavity, and an inlet for injecting a preset flow of electroplating solution is formed in the bottom of the electroplating cavity. An annular anode is arranged in theelectroplating cavity, and a cathode mechanism for clamping the metal workpiece is arranged above the electroplating cavity. During electroplating, the metal workpiece is inserted into the electroplating cavity from the outlet, is placed in the annular anode, and is electroplated by powering on the annular anode and the cathode mechanism. The metal workpiece can be placed in an independent electroplating environment, so that the electroplating effect of the metal workpiece is improved and the electroplating process can be monitored.

Description

technical field [0001] The invention relates to an electroplating device, in particular to an independent electroplating device and process for hardware workpieces. Background technique [0002] In the prior art, common hardware electroplating devices generally use hanging baskets or racks, etc. to place multiple hardware workpiece products in an electroplating tank at the same time, and use an electroplating power supply to energize the cathode and anode in the electroplating tank, and the electroplating process In the process, multiple hardware workpieces are placed in the same electric field, and there is mutual influence between the hardware workpiece products, which makes it difficult to achieve the desired effect of the electroplating effect of the hardware workpiece, and it is impossible to independently monitor the electroplating process of each hardware workpiece product, especially not applicable In some occasions with selective plating requirements. Contents of ...

AI Technical Summary

Problems solved by technology

[0002] In the prior art, common hardware electroplating devices generally use hanging baskets or racks, etc. to place multiple hardware workpiece products in an electroplating tank at the same time, and use an electroplating power supply to energize the cathode and anode in the electroplating tank, and the electroplating process In the process, multiple hardware workpieces are placed in the same electric field, and there is mutual influence between the hardware workpiece products, which makes it difficult to achieve the desired effect of the electroplating effect of the hardware workpiece, and it is impossible to independently monitor the electroplating process of each hardware workpiece product, especially not applicable In some occasions with selective plating requirements

Images