Independent electroplating device and process for metal workpiece

An electroplating device and electroplating process technology, applied in the direction of electrodes, electrolytic processes, electrolytic components, etc., can solve the problems of inapplicability, inability to independently monitor the electroplating process of hardware workpiece products, and the difficulty in achieving the ideal effect of electroplating of hardware workpieces, etc., to meet the application requirements Demand, the effect of improving the quality of electroplating processing

Pending Publication Date: 2020-01-17
JUNJIE MACHINERY SHENZHEN
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AI-Extracted Technical Summary

Problems solved by technology

[0002] In the prior art, common hardware electroplating devices generally use hanging baskets or racks, etc. to place multiple hardware workpiece products in an electroplating tank at the same time, and use an electroplating power supply to energize the cathode and anode in the electroplating tank, and the electroplating process In the process, multiple hardware workpieces are placed in th...
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Method used

In the above-mentioned device, before the electroplating, the metal workpiece 100 is clamped in the cathode mechanism 2, and the electroplating solution of the preset flow rate is continuously injected into the inlet 11 by using a preset pump body and other devices, and the After the electroplating solution flows out through the outlet 10, the electroplating chamber 1 is filled with flowing electroplating solution, and then the hardware workpiece 100 is inserted into the electroplating chamber 1 through the outlet 10 until the hardware The workpiece 100 is located inside the ring-shaped anode 12 , and the ring-shaped anode 12 and the cathode mechanism 2 are energized by a preset electroplating power source, so that the metal workpiece 100 is electroplated in an independent elect...
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Abstract

The invention discloses an independent electroplating device for a metal workpiece. The device comprises an electroplating cavity, wherein an outlet through which the metal workpiece can pass is formed in the top of the electroplating cavity, and an inlet for injecting a preset flow of electroplating solution is formed in the bottom of the electroplating cavity. An annular anode is arranged in theelectroplating cavity, and a cathode mechanism for clamping the metal workpiece is arranged above the electroplating cavity. During electroplating, the metal workpiece is inserted into the electroplating cavity from the outlet, is placed in the annular anode, and is electroplated by powering on the annular anode and the cathode mechanism. The metal workpiece can be placed in an independent electroplating environment, so that the electroplating effect of the metal workpiece is improved and the electroplating process can be monitored.

Application Domain

Electrodes

Technology Topic

ElectroplatingAnode +1

Image

  • Independent electroplating device and process for metal workpiece
  • Independent electroplating device and process for metal workpiece

Examples

  • Experimental program(1)

Example Embodiment

[0018] The present invention will be described in more detail below with reference to the drawings and embodiments.
[0019] The invention discloses an independent electroplating device for hardware workpieces, please refer to figure 1 , Which includes an electroplating cavity 1, the top of the electroplating cavity 1 is provided with an outlet 10 for the hardware workpiece 100 to pass through, and the bottom of the electroplating cavity 1 is provided with a predetermined flow of electroplating solution At the entrance 11, the electroplating chamber 1 is provided with a ring-shaped anode 12, and the electroplating chamber 1 is provided with a cathode mechanism 2 for clamping the hardware workpiece 100. During electroplating, the hardware workpiece 100 is removed from The outlet 10 is inserted into the electroplating chamber 1, and the hardware workpiece 100 is placed in the ring-shaped anode 12. The ring-shaped anode 12 and the cathode mechanism 2 are energized to make the The metal workpiece 100 is electroplated.
[0020] In the above device, the hardware workpiece 100 is clamped to the cathode mechanism 2 before electroplating, and a preset pump body is used to continuously inject a preset flow of electroplating solution into the inlet 11, and the electroplating solution After flowing out through the outlet 10, the electroplating chamber 1 is filled with flowing electroplating solution, and then the hardware workpiece 100 is inserted into the electroplating chamber 1 through the outlet 10 until the hardware workpiece 100 is located Inside the ring anode 12, a preset electroplating power supply is used to energize the ring anode 12 and the cathode mechanism 2, so that the hardware workpiece 100 is electroplated in an independent electroplating environment. Compared with the prior art, the present invention uses the electroplating chamber 1 to provide an independent electroplating environment for the hardware workpiece 100, which can avoid factors such as batch electroplating from affecting the electroplating effect of the hardware workpiece 100, thereby improving the hardware workpiece 100 In addition, the present invention uses an independent electroplating environment to perform electroplating processing on the hardware workpiece 100, which helps to monitor the electroplating process of the hardware workpiece 100, and is especially suitable for occasions with selective electroplating requirements. It satisfies the application requirements well.
[0021] In order to support the electroplating cavity 1, in this embodiment, the electroplating cavity 1 is fixed on a supporting plate 3, and the supporting plate 3 is placed in a preset electroplating box.
[0022] As a preferred structure, the electroplating chamber 1 has a circular tube shape. However, this is only a preferred way. In other embodiments of the present invention, the electroplating cavity 1 may also be configured as a square tube or a cavity structure of other shapes. The specific shape of the electroplating cavity 1 is Without limitation, any cavity in the prior art that can provide an independent electroplating environment belongs to the protection scope of the present invention.
[0023] This embodiment also includes a moving mechanism for driving the cathode mechanism 2 to rise or fall. Specifically, the moving mechanism may be a transfer device such as a crane or a manipulator.
[0024] As a preferred manner, an inner edge 13 protruding inward is formed at the edge of the outlet 10. The inner edge 13 can form an inner shrinkage at the outlet 10 to meet different electroplating requirements.
[0025] In this embodiment, the electroplating chamber 1 is provided with a plane anode 14, the plane anode 14 is located below the annular anode 12, and the plane anode 14 faces the lower end of the hardware workpiece 100. Further, the flat anode 14 may also be provided with an auxiliary anode that can extend into the hardware workpiece 100. The function of the above-mentioned flat anode 14 is to be able to perform electroplating processing on the end surface and the inner side of the hardware workpiece 100.
[0026] As a preferred manner, the electroplating cavity 1 is a cavity made of insulating material. Specifically, the electroplating cavity 1 is preferably a cavity made of plastic material.
[0027] In order to meet the requirements of batch electroplating, in this embodiment, the number of the electroplating cavities 1 is multiple, and the multiple electroplating cavities 1 are all fixed on the supporting plate 3. In the above structure, the same electroplating box can be used to electroplating multiple hardware workpieces 100 at the same time, but each hardware workpiece 100 is separately electroplated in an electroplating chamber 1, thereby providing an independent electroplating environment for each hardware workpiece 100.
[0028] The invention also relates to an independent electroplating process for hardware workpieces, which combines figure 1 with figure 2 As shown, the process is implemented based on a device that includes an electroplating cavity 1 with an outlet 10 on the top of the electroplating cavity 1, an inlet 11 on the bottom of the electroplating cavity, and the electroplating cavity A ring-shaped anode 12 is provided in the body 1, and a cathode mechanism 2 is provided above the electroplating chamber 1, and the process includes the following steps:
[0029] Step S1, clamping the hardware workpiece 100 to the cathode mechanism 2;
[0030] Step S2, continuously injecting a preset flow of electroplating solution into the inlet 11, and the electroplating solution flows out through the outlet 10;
[0031] Step S3, insert the hardware workpiece 100 into the electroplating chamber 1 from the outlet 10 until the hardware workpiece 100 is located inside the ring anode 12;
[0032] In step S4, the annular anode 12 and the cathode mechanism 2 are energized, and then the hardware workpiece 100 is electroplated.
[0033] In the step S2 of the above process, the electroplating solution injected into the inlet 11 is the electroplating solution at a preset temperature;
[0034] In addition, in the step S3, the cathode mechanism 2 and the hardware workpiece 100 are driven to rise or fall by a preset moving mechanism.
[0035] In the independent electroplating device and process for hardware workpieces disclosed in the present invention, each electroplating cavity corresponds to a hardware workpiece product. Compared with the prior art, the present invention can avoid the mutual influence between the hardware workpiece products, thereby improving the electroplating quality. During the electroplating process, each hardware product can be powered independently, and different electroplating parameters can be set for different hardware products. When necessary, the electroplating parameters of all hardware products can be recorded by the preset PLC controller. By setting the program and organizing into reports, with the traceability system, you can easily find the complete electroplating process of each hardware product, and then meet the requirements of intelligent technology.

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