Tinned copper wire electroplating device

Abstract

The invention relates to the field of electroplating devices, in particular to a tinned copper wire electroplating device which comprises an electroplating tank body. A first vertical plate is vertically and fixedly connected to the upper end of one side of the electroplating tank body, and the first vertical plate is of a U-shaped structure and is provided with an upward opening. According to thetinned copper wire electroplating device, a downward pressing mechanism is arranged on a first carrier plate, a mounting plate with a lifting mechanism is arranged on the first vertical plate, the lifting mechanism is connected with the downward pressing mechanism through a transmission mechanism, and a second roller is mounted on the mounting plate; and when a copper wire is loosened, a fixing plate can be moved downwards through an air cylinder of the downward pressing mechanism, the fixing plate drives a first roller to move downwards, meanwhile, a toothed plate on the fixing plate rotatesa fixing rod of the transmission mechanism, the fixing rod rotates a first bevel gear of the lifting mechanism through a second bevel gear, a lifting screw jacks up the mounting plate, and the secondroller on the mounting plate can be matched with the first roller to tension a copper wire, so that the conditions that a part of copper wire stays in the electroplating tank body for a long time, consequently, an electroplated layer of the part of copper wire is too thick, and liquid tin is wasted are avoided.

Description

technical field [0001] The invention relates to the field of electroplating devices, in particular to a tinned copper wire electroplating device. Background technique [0002] Tin plating and its alloys are coatings with good solderability and certain corrosion resistance, and are widely used in electronic components and printed circuit boards. In addition to physical methods such as hot dipping and spraying, methods such as electroplating, immersion plating and chemical plating have been widely used in industry because of their simplicity. In order to protect copper wires from oxidation during processing, copper wires are usually placed in the The outside of the copper wire is plated with tin. [0003] At present, the copper wire will be cleaned first when tinning, and then it can be electroplated. If the surface of the cleaned copper wire remains water and the chemicals used in the cleaning process, when the copper wire enters the electroplating tank, it will pollute the ...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problems in the prior art, the present invention provides a tin-plated copper wire electroplating device, which solves the problem that the current copper wire will first be cleaned before being electroplated during tinning, and if the surface of the cleaned copper wire remains With water and chemicals used for cleaning, when the copper wire enters the electroplating tank, it will pollute the liquid tin in the electroplating tank and affect the effect of electroplating. If the copper wire becomes loose during the transportation process, it will cause some copper on the copper wire during electroplating. During the time when the wire stays in the electroplating tank, the thickness of the coating on the surface of the copper wire varies, wasting part of the liquid tin, and affects the appearance of the copper wire. At the same time, when the copper wire leaves the electroplating tank, if some copper wires are stained with more liquid After the tin and copper wire leave the electroplating tank, the excess liquid tin will solidify, causing bumps on the surface of the copper wire, which will affect the processing of the copper wire

Images