A source-drain resistance variable bidirectional switch field effect transistor and its manufacturing method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 山东光岳九州半导体科技有限公司
- Publication Date
- 2019-10-15
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of ultra-large-scale integrated circuit manufacturing, in particular to a source-drain resistance variable bidirectional switch field effect transistor with low leakage current suitable for low-power integrated circuit manufacturing and a manufacturing method thereof. Background technique
[0002] According to the requirements of Moore's law, MOSFETs, the basic unit of integrated circuits, must become smaller and smaller in size. The resulting problem is not only the increase in the difficulty of the manufacturing process, but also the adverse effects of the device itself caused by the smaller size. highlight. Due to the limitation of the physical mechanism of current generation of MOSFETs used in integrated circuit design, the subthreshold swing cannot be lower than 60mV / dec.
[0003] When ordinary tunneling field effect transistors are used as switching devices, the tunneling mechanism of carriers is used, which ca...