Source-drain symmetrical interchangeable bidirectional tunneling field effect transistor and manufacturing method thereof

A tunneling field effect, transistor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problem that the sub-threshold swing cannot be reduced and can only be used as a unidirectional switch, etc., to achieve good tunneling current. Significant increase, suppression of significant increase in tunneling current, effect of good gate control capability

Active Publication Date: 2019-10-15
宿松新驱光电科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to effectively combine and utilize the advantages of interchangeable sources and drains of MOSFETs type devices and the low subthreshold swing of ordinary tunneling field effect transistors, solve the problem that the subthreshold swing of MOSFETs type devices cannot be reduced and ordinary tunneling field effect transistors can only As the deficiency of the unidirectional switch, the present invention proposes a bidirectional tunneling field effect transistor with source-drain symmetry and interchangeable and its manufacturing method

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  • Source-drain symmetrical interchangeable bidirectional tunneling field effect transistor and manufacturing method thereof
  • Source-drain symmetrical interchangeable bidirectional tunneling field effect transistor and manufacturing method thereof
  • Source-drain symmetrical interchangeable bidirectional tunneling field effect transistor and manufacturing method thereof

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Embodiment Construction

[0061] Below in conjunction with accompanying drawing, the present invention will be further described:

[0062] Such as figure 1 with figure 2 As shown, a source-drain symmetric interchangeable bidirectional tunneling field effect transistor includes a silicon substrate 12 of an SOI wafer, and the silicon substrate 12 of the SOI wafer is above the substrate insulating layer 11 of the SOI wafer; the SOI wafer Above the round substrate insulating layer 11 is a single crystal silicon film 1, a first-type impurity heavily doped region 2 and a partial area of ​​the insulating dielectric barrier layer 13; wherein, the single crystal silicon film 1 has an impurity concentration lower than 1016 cm-3 The single crystal silicon semiconductor material; the first type of impurity heavily doped region 2 is located in the middle part of the bottom of the single crystal silicon film 1, and the conductivity type of the doped impurity determines the conduction type of the device, and its in...

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Abstract

The invention relates to a bidirectional tunneling field-effect transistor with symmetric and replaceable source and drain and a manufacturing method of the bidirectional tunneling field-effect transistor. The device has horizontal symmetric structure characteristic, a second-type impurity heavy-doping source-drain replaceable region is controlled as a source region or a drain region by adjustingreplaceable electrode voltages of the source and the drain, and a tunneling current direction is changed. The bidirectional tunneling field-effect transistor has the advantages of low static power consumption, high forward-reverse current ratio, low reverse leakage current characteristic and low sub-threshold amplitude, and the bidirectional switching function can be achieved; compared with a conventional MOSFETs device, the bidirectional tunneling field-effect transistor has the advantages that more excellent switch characteristic is achieved by a tunneling effect; and compared with a conventional tunneling field-effect transistor, the bidirectional tunneling field-effect transistor has bidirectional and symmetric switch characteristic that the source and the drain can be replaced with each other and is not possessed by the conventional tunneling field-effect transistor, and thus, the bidirectional tunneling field-effect transistor is suitable for promotion and application.

Description

technical field [0001] The invention relates to the field of ultra-large-scale integrated circuit manufacturing, in particular to a source-drain symmetrical interchangeable bidirectional tunneling field effect transistor with low leakage current and a manufacturing method thereof suitable for low-power integrated circuit manufacturing. Background technique [0002] According to the requirements of Moore's law, the basic unit MOSFETs of integrated circuits will become smaller and smaller in size, which will not only increase the difficulty of the manufacturing process, but also cause various adverse effects to become more prominent. Due to the limitations of the physical mechanism of current generation in the MOSFETs used in IC design today, the subthreshold swing cannot be lower than 60mV / dec. When the ordinary tunneling field effect transistor is used as a switching device, the tunneling effect of carriers between the semiconductor energy bands is used as the conduction mec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/06H01L29/08H01L29/423H01L29/739H01L21/331H01L21/28
Inventor 靳晓诗高云翔刘溪
Owner 宿松新驱光电科技有限公司
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