Thin film package and display panel

A thin-film packaging and substrate technology, applied in semiconductor devices, electrical solid devices, semiconductor/solid device manufacturing, etc., can solve the problems of weak resistance to water and oxygen and bending resistance

Active Publication Date: 2020-06-19
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present application provides a thin film package and a display panel to solve the problem of weak water, oxygen and bending resistance of the thin film package in the prior art

Method used

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  • Thin film package and display panel
  • Thin film package and display panel
  • Thin film package and display panel

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Embodiment Construction

[0021] In order for those skilled in the art to better understand the technical solution of the present application, a thin film packaging body, a display panel and a thin film packaging method provided by the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] see Figure 1-3 , figure 1 It is a structural schematic diagram of the first embodiment of the thin film packaging body of the present application, figure 2 yes figure 1 A schematic diagram of a first possible shape of the first embodiment of the thin film encapsulation shown, image 3 yes figure 1 Schematic illustration of a second possible shape for the first embodiment of the thin film encapsulation shown.

[0023] The thin film package 100 of this embodiment includes a substrate layer 11 and an inorganic conformal layer 12 . The substrate layer 11 includes at least one organic substrate layer 111, at least part of one side of the or...

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Abstract

The present application discloses a thin film packaging body and a display panel, wherein the thin film packaging body includes a substrate layer, including at least one organic substrate layer, wherein at least part of one side of the organic substrate layer has a relief structure; an inorganic conformal layer, stacked and co-formed The shape is arranged on the side of the organic substrate layer with the undulating structure. The thin film package body of the present application has strong water and oxygen resistance and bending resistance.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a thin film packaging body and a display panel. Background technique [0002] The display panel has been gradually developed from the former Cathode Ray Tube (CRT) display to the current Liquid Crystal Display (LCD), and the current Organic Light Emitting Diode (OLED) technology is gradually emerging. [0003] For OLED, it is easily affected by water and oxygen, resulting in a sharp attenuation of performance. In order to solve this problem and take into account the flexible requirements of the panel, OLEDs are generally packaged by thin-film packaging, and the thin-film packaging currently used in OLEDs There are usually problems with water and oxygen resistance and weak bending resistance. Contents of the invention [0004] The present application provides a thin film packaging body and a display panel to solve the problem of weak water and oxygen resistance and b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/00H10K50/84
Inventor 李加伟郭瑞
Owner YUNGU GUAN TECH CO LTD
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