Positive photosensitive resin composition

A technology of photosensitive resin and composition, applied in photosensitive material processing, optics, photomechanical equipment, etc., can solve problems such as low cured film characteristics, difficulty in chemical resistance and adhesiveness, and inability to cope with the production of packaging , to achieve the effect of excellent liquid resistance

Active Publication Date: 2021-07-02
HD MICROSYSTEMS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, for the conventional resin composition for rewiring formation layer (using polybenzo For the positive photosensitive resin composition of azole precursor), it is difficult to have high chemical resistance and adhesiveness in the case of low-temperature curing, and it is not suitable for the production of this package.
[0010] Patent Document 4 discloses that by using polybenzo High sensitivity and high resolution can be achieved by combining specific crosslinking agent and photosensitizer in azole precursor, but the characteristics of cured film at low temperature curing are low

Method used

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  • Positive photosensitive resin composition
  • Positive photosensitive resin composition
  • Positive photosensitive resin composition

Examples

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Embodiment

[0211] Hereinafter, based on an Example and a comparative example, this invention is demonstrated further concretely. It should be noted that the present invention is not limited to the following examples.

Synthetic example 1

[0213] [(a) Ingredient: polybenzo Synthesis of azole precursor (polymer I)]

[0214] Into a 0.2-liter flask equipped with a stirrer and a thermometer, 60 g of N-methylpyrrolidone was charged, 13.92 g (38 mmol) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane was added, and stirred to dissolve. Next, while maintaining the temperature at 0 to 5°C, 7.48 g (28 mmol) of dodecane dichloride and 3.56 g (12 mmol) of 4,4'-diphenyl ether dichloride were added dropwise over 10 minutes. , and the solution in the flask was stirred for 60 minutes. The above solution was dropped into 3 liters of water, the precipitate was recovered, washed 3 times with pure water, and then decompressed to obtain a polybenzoic acid having a structure represented by formula (1). An azole precursor (hereinafter referred to as polymer I). The weight-average molecular weight of the polymer I was calculated in terms of standard polystyrene using gel permeation chromatography (GPC), and it was 42,000, and ...

Synthetic example 2

[0228] [(a) Ingredient: polybenzo Synthesis of azole precursor (polymer II)]

[0229] In addition to replacing 7.48 g (28 mmol) of dodecanoyl dichloride and 3.56 g (12 mmol) of 4,4'-diphenyl ether dichloride used in Synthesis Example 1 with sebacoyl chloride (40 mmol), and Synthesis example 1 is synthesized similarly, obtains the polybenzoic acid having the structure represented by formula (1) An azole precursor (hereinafter referred to as polymer II). Polymer II had a weight average molecular weight of 38,000 and a dispersity of 2.0.

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Abstract

A positive photosensitive resin composition, which contains (a) polybenzoxazole precursor, (b) crosslinking agent, (c) photosensitizer and (d) solvent, said (a) polybenzoxazole precursor The body contains a structure represented by the following formula (1), and the (c) photosensitizer is a compound containing a structure represented by the following formula (2). In formula (1), U is a divalent organic group, a single bond, -O- or -SO 2 ‑, V is a group containing an aliphatic structure, and the number of carbon atoms in the aliphatic structure is 1-30.

Description

technical field [0001] The present invention relates to a positive-type photosensitive resin composition, a cured product of the positive-type photosensitive resin composition, an interlayer insulating film using the cured product, a cover coat or a surface protection film, an electronic component including them, and a pattern Method for producing cured film. Background technique [0002] Conventionally, polyimide and polybenzone, which have excellent heat resistance, electrical properties, and mechanical properties, have been used in surface protection films and interlayer insulating films of semiconductor elements. azole. In recent years, the photosensitive resin composition which provided the photosensitive characteristic to these resin itself is used, and the manufacturing process of patterned cured film can be simplified by this, and a complicated manufacturing process can be shortened. [0003] In the manufacturing process of the pattern cured film, what used in the...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): G03F7/023G03F7/004
CPCG03F7/0233G03F7/0226G03F7/023G03F7/039G03F7/20G03F7/26G03F7/40G03F7/004G03F7/162G03F7/168G03F7/2004G03F7/322
Inventor松川大作中村惟允
OwnerHD MICROSYSTEMS LTD