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Diode pin cutting mechanism

A cutting mechanism and diode technology, which is applied in the field of diode pin cutting mechanism, can solve the problems of splashing around the pins, and achieve the effects of solving the splashing, facilitating cutting processing and effective positioning

Active Publication Date: 2019-01-04
泸州龙芯微科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention intends to provide a diode pin cutting mechanism to solve the problem of the pins splashing around after being cut by a cutter

Method used

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  • Diode pin cutting mechanism

Examples

Experimental program
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Embodiment Construction

[0018] The present invention will be described in further detail below by means of specific embodiments:

[0019] The reference signs in the drawings of the description include: cutter 1, transmission table 2, rotating table 3, fixed plate 4, arc plate 5, rotating gear 6, rack 7, cutting seam 8, blowing pipe 9, baffle plate 10 , wedge 11, intubation tube 12, liquid injection tank 13, jacking pipe 14, cavity 15, opening and closing plate 16, liquid injection tank 17, support platform 18, driving bevel gear 19, driven bevel gear 20, metal strip 21 .

[0020] Example figure 1 Shown: Diode lead cutting mechanism, including cutting mechanism, rotating drive mechanism, conveying mechanism and unloading mechanism.

[0021] The cutting mechanism is used for cutting the metal strip 21 to be processed, and its structure includes a cutting table and a cutting knife. The cutting table includes a transfer table 2 and a rotating table 3 which are fixedly connected by bolts, and there is ...

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PUM

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Abstract

The invention relates to the field of semiconductor device pin cutting machining, and discloses a diode pin cutting mechanism. The diode pin cutting mechanism comprises a cutter and a cutting platform, the cutting platform comprises a conveying platform and a rotating platform which are fixedly connected, a gap is formed between the conveying platform and the rotating platform to form a cutting seam, grooves used for containing metal strips are formed in the conveying platform and the rotating platform, a fixing plate is arranged over the groove of the conveying platform in a crossed mode, anarc-shaped plate is arranged over the groove of the rotating platform in a crossed mode, the arc-shaped plate and the fixing plate are both used for fixing the metal strips, and a rotating platform driving mechanism is connected to the rotating platform. According to the diode pin cutting mechanism, the problem that splashing occurs after a pin is cut by the cutter can be solved.

Description

technical field [0001] The invention relates to the field of cutting processing of semiconductor device pins, in particular to a diode pin cutting mechanism. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical properties of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor material of semiconductor devices is silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment, and has important applications in the field of electrical technology. Diodes are one of semiconductor devices. It has important applications in the field of electricity. [0003] The diode contains pins, and when processing the pins, it is necessary to cut the long metal strip int...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21F11/00
CPCB21F11/00
Inventor 黄晓波
Owner 泸州龙芯微科技有限公司
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