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Method for synthetizing polyamic acid resin from 1,3-bis[4-(3-aminophenoxy)benzoyl] benzene

A technology of polyamic acid resin and aminophenoxy, which is applied in the field of polyimide film preparation, can solve the problems of low shrinkage, the inability to achieve ultra-thin flexible circuits, and difficulty in achieving ultra-thin stable film structures, and achieve shrinkage low effect

Active Publication Date: 2019-03-01
JIANGSU YABAO INSULATION MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, the thinnest polyimide film thickness in China is 24um, but the traditional formula of pyromellitic dianhydride and 4,4,-diaminodiphenyl ether is still used, and it is difficult to achieve an ultra-thin and stable film structure. There are problems such as shrinkage, and it cannot meet the technical requirements of ultra-thin and ultra-low shrinkage required by flexible circuits.

Method used

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  • Method for synthetizing polyamic acid resin from 1,3-bis[4-(3-aminophenoxy)benzoyl] benzene
  • Method for synthetizing polyamic acid resin from 1,3-bis[4-(3-aminophenoxy)benzoyl] benzene
  • Method for synthetizing polyamic acid resin from 1,3-bis[4-(3-aminophenoxy)benzoyl] benzene

Examples

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Embodiment 1

[0016] A method for synthesizing polyamic acid resin with 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene, according to the following steps:

[0017] (1) According to the parts by weight, take 80g of 1,3-bis(4-fluorobenzoyl)benzene and 30g of 3-aminophenol, dissolve them in 1200mL of dimethylformamide, add 15g of potassium carbonate, and heat to 60°C , stirred for 20min to make 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene;

[0018] (2) Add 60 g of pyromellitic dianhydride, add 400 mL of 20% dimethylformamide aqueous solution, and react for 20 minutes to make polyimide resin liquid, and remove dimethylformamide;

[0019] (3) Send the polyimide resin liquid prepared in step (2) into an extrusion coating machine, apply the polyimide resin liquid to the steel strip through the extrusion die head, and electronically control the die head The gap at the exit controls the thickness of the membrane, and the thickness of the membrane is 12.5um;

[0020] (4) The polyimide film formed by extrusi...

Embodiment 2

[0022] A method for synthesizing polyamic acid resin with 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene, according to the following steps:

[0023] (1) According to parts by weight, take 50g of 1,3-bis(4-fluorobenzoyl)benzene and 20g of 3-aminophenol, dissolve them in 800mL of dimethylformamide, add 10g of potassium carbonate, and heat to 50°C , stirred for 10min to produce 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene;

[0024] (2) Add 30 g of pyromellitic dianhydride, add 300 mL of 20% dimethylformamide aqueous solution, and react for 10 minutes to make polyimide resin liquid, and remove dimethylformamide;

[0025] (3) Send the polyimide resin liquid prepared in step (2) into an extrusion coating machine, apply the polyimide resin liquid to the steel strip through the extrusion die head, and electronically control the die head The gap at the outlet controls the thickness of the film, and the thickness of the film is 11um;

[0026] (4) The polyimide film formed by extrusion coating...

Embodiment 3

[0028] A method for synthesizing polyamic acid resin with 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene, according to the following steps:

[0029] (1) According to the parts by weight, take 100g of 1,3-bis(4-fluorobenzoyl)benzene and 40g of 3-aminophenol, dissolve them in 1500g of dimethylformamide, add 20g of potassium carbonate, and heat to 80°C , stirred for 30min to make 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene;

[0030] (2) Add 80 g of pyromellitic dianhydride, add 500 mL of 20% dimethylformamide aqueous solution, and react for 30 minutes to make polyimide resin liquid, and remove dimethylformamide;

[0031] (3) Send the polyimide resin liquid prepared in step (2) into an extrusion coating machine, apply the polyimide resin liquid to the steel strip through the extrusion die head, and electronically control the die head The gap at the outlet controls the thickness of the film, and the thickness of the film is 13um;

[0032] (4) The polyimide film formed by extrusion coati...

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Abstract

The invention discloses a method for synthetizing polyamic acid resin from 1,3-bis[4-(3-aminophenoxy)benzoyl] benzene. The method is characterized in that 1,3-bis(4-fluorobenzoyl) benzene and 3-aminophenol react to prepare the 1,3-bis[4-(3-aminophenoxy)benzoyl] benzene; then, the 1,3-bis[4-(3-aminophenoxy)benzoyl] benzene and pyromellitic dianhydride react to synthetize the polyamic acid resin; after extruding coating, imine formation is performed to prepare a polyimide thin film. The thickness of the prepared thin film is thin and can reach 11 to 13 mu m; the thin film is suitable for flexible circuit material preparation; the contraction rate is low; the volume resistivity reaches 10<12> Omega.m or higher; the surface resistivity reaches 10<14> Omega.

Description

technical field [0001] The invention belongs to the technical field of polyimide film preparation, and in particular relates to a method for synthesizing polyamic acid resin with 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene. Background technique [0002] Polyimide is a class of engineering plastics with high modulus, high strength, low water absorption and thermal oxidation stability. As early as 1908, Bogert prepared aromatic polyimide by intramolecular polycondensation of 4-aminophthalic anhydride or dimethyl 4-aminophthalate. So far, polyimide has received more and more people's attention and development. In the 1970s, our country was led by the former Ministry of Machinery and the Ministry of Chemical Industry to develop this material for electrical insulation. [0003] With the rapid development of my country's digital products, smart home appliances, automotive electronics, etc., the rapid growth of the flexible circuit board market has been promoted. For example, in t...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/1007C08G73/1071C08J5/18C08J2379/08
Inventor 徐伟伟杨楚罗张克杰李秋影刘战合
Owner JIANGSU YABAO INSULATION MATERIAL
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