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Novel Laser Structured Diamond Abrasive Polishing Pad and Its Abrasive Grain Structuring Method

A laser structuring and diamond technology, used in abrasives, metal processing equipment, manufacturing tools, etc., can solve the problem of multi-directional movement that cannot be used for polishing, and achieve high abrasive hardness, improved surface integrity, and improved surface processing quality. Effect

Active Publication Date: 2019-12-13
GUIZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This invention provides an idea to improve the processing quality by directly changing the surface characteristics of abrasive grains, but the processing object of this invention is only used for diamond abrasive grains during grinding, and the abrasive grains that only ablate one corner cannot be used. Multidirectional movement during polishing

Method used

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  • Novel Laser Structured Diamond Abrasive Polishing Pad and Its Abrasive Grain Structuring Method
  • Novel Laser Structured Diamond Abrasive Polishing Pad and Its Abrasive Grain Structuring Method
  • Novel Laser Structured Diamond Abrasive Polishing Pad and Its Abrasive Grain Structuring Method

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Embodiment 1

[0026] Embodiment 1: as Figure 1-Figure 7 As shown, a laser structured diamond abrasive polishing pad includes diamond abrasive grains 1 and a polishing pad 2, and the polishing pad 2 is covered with diamond abrasive grains 1, and the surface of the diamond abrasive grains 1 has many micro-edges 3 and Abrasive groove 4.

[0027] Preferably, the above-mentioned polishing pad 2 is made of a hydrophilic material, and the diamond abrasive grains 1 are thermally fixed on the polishing pad 2 by resin to form a square small protrusion array structure 5 and spacing grooves 6 between the arrays.

[0028] A method for structuring abrasive grains of a laser structured diamond abrasive grain polishing pad, the method comprising the following steps:

[0029] (1) Choose truncated octahedral diamond as the diamond abrasive grain, the abrasive grain size is 50 μm, and the characteristics of the original abrasive grain are as follows: figure 1 As shown, the diamond abrasive grains that need...

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Abstract

The invention discloses a novel laser-structuring diamond abrasive particle polishing pad which comprises diamond abrasive particles and a polishing pad. The diamond abrasive particles are paved on the polishing pad; and multiple micro blades and grooves with unequal heights are formed in the surfaces of the diamond abrasive particles. According to the laser-structuring diamond abrasive particle polishing pad provided by the invention, surface / subsurface damages such as microcracks, residual stress, phase change, dislocation and corrugation of a polished material can be effectively reduced, and the surface integrity of a workpiece is remarkably improved; and the polishing pad is high in abrasive particle hardness and high in adaptability, can be widely applied to polishing ceramics, monocrystalline silicon, KDP (potassium dihydrogen phosphate), GaAs (gallium arsenide) and other hard and brittle / soft and brittle materials, and has a significance on improving the surface processing quality of basic parts in the strategic industry in China.

Description

technical field [0001] The invention relates to a laser structured diamond abrasive polishing pad and a method for structuring the abrasive grain, and belongs to the technical field of diamond abrasive polishing pads. Background technique [0002] Diamond structuring refers to the formation of macroscopic or microscopic grooves or geometric shapes on the diamond surface by some methods to achieve the purpose of improving diamond polishing performance. According to the different sizes of grooves or geometric shapes, the structuring of diamond can be divided into two types: macro structuring and micro structuring. The structuring in the patent belongs to the microstructuring of diamond. [0003] At present, chemical mechanical polishing (CMP) technology has been widely used in the semiconductor wafer and integrated circuit manufacturing process. As the main component of the CMP system, the polishing pad plays the role of storing the polishing liquid and transporting them to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D11/00
Inventor 戴厚富周玉琪张法
Owner GUIZHOU UNIV
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