Air-cooled heat radiation device and using method thereof
A heat sink and air cooling technology, applied in cooling/ventilation/heating renovation, electrical components, electrical equipment structural parts, etc., can solve the problems of not bringing heat to the outside space, unsuitable for use in harsh environments, etc., and achieve a simple structure. , good heat dissipation effect, the effect of speeding up heat dissipation
Inactive Publication Date: 2019-08-06
XIAN MICROELECTRONICS TECH INST
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Problems solved by technology
[0003] The air-cooled cold plate structure has been widely used in the field of electronic equipment. The common structural form is that the axial flow fan is installed outside or inside the case. The stirring fan installed in the case can only accelerate the internal air flow, and has not realized Take its heat to the outside space, while the open chassis with external fans installed cooling performance is good, but not suitable for use in harsh environments
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[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. the embodiment. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0035] combine figure 1 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, as a preferred embodiment of the present invention, an air-cooled heat dissipation device includes a first cover plate 1, a fan 2, a guide pin 3, a power supply connector 4, a heat dissipation substrate 5, a heat dissipation fin 6 and a second Cover plate 9, specifically, such as Figure 4 As sh...
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Abstract
The invention discloses an air-cooled heat radiation device and a using method thereof. An air channel groove is formed in the upper end surface of a heat radiation substrate, an air channel cover plate covers a notch of the air channel groove, the air channel cover plate and the air channel groove form an air channel, first through holes are formed in the air channel cover plate, second through holes are formed in the air channel cover plate in positions far from the first through holes, a blower fan is arranged in the air channel groove, an air inlet of the blower fan is communicated with the second through holes, and an air outlet of the blower fan is communicated with the first through holes. Cold air is sucked in by the blower fan via the second through holes, flows through the air channel, cools heat absorbed by the heat radiation substrate and is then blown out via the first through holes, thus, heat of a heat source body is brought to the outside, and a heating component has agood heat radiation effect; the blower fan arranged in the wind channel can be adapted to the severe environment; and the wind channel is designed outside a heat source body cabinet, the wind resistance is reduced, secondary conductive heat resistance is reduced, the using safety of the blower fan is ensured, the structure is simple, and use is safe and reliable.
Description
technical field [0001] The invention belongs to the field of heat dissipation of electronic equipment, and in particular relates to an air-cooled heat dissipation device and a using method thereof. Background technique [0002] With the rapid development of electronic technology, electronic products are developing in the direction of high power, high density and high efficiency. This development leads to a sharp increase in the heat generation of electronic components. How to effectively dissipate heat from the heating components inside the equipment and ensure the normal operation of the computer has become a key problem for designers to solve for electronic equipment used in harsh environments while ensuring good sealing. [0003] The air-cooled cold plate structure has been widely used in the field of electronic equipment. The common structural form is that the axial flow fan is installed outside or inside the case, and the stirring fan installed in the case can only acce...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20409
Inventor 高晓红梁远蕾司晓磊
Owner XIAN MICROELECTRONICS TECH INST