Electromagnetic wave shielding film, shielding printed circuit board and electronic equipment
A printed circuit board and electromagnetic wave technology, which is applied in the fields of magnetic/electric field shielding, circuit devices, printed circuit components, etc., can solve problems such as deterioration of shielding characteristics and damage to interlayer tight bonding, and achieve high shielding characteristics and shrink The effect that space and interlayer tightness are not easy
Active Publication Date: 2020-12-22
TATSUTA ELECTRICWIRE & CABLE +1
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Therefore, when rapid heating is performed in the solder reflow process, the volatile components accumulated between the shielding layer and the conductive adhesive layer may cause the interlayer adhesion between the shielding layer and the conductive adhesive layer to be destroyed, and the shielding properties may be damaged. become worse
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0084] Hereinafter, the electromagnetic wave shielding film of this invention is demonstrated concretely. However, the present invention is not limited to the following embodiments, and can be appropriately modified and used without changing the gist of the present invention.
[0085] figure 2 It is a cross-sectional schematic diagram of an example of the electromagnetic wave shielding film of this invention.
[0086] Such as figure 2 As shown, the electromagnetic wave shielding film 10 includes a conductive adhesive layer 20 , a shielding layer 30 laminated on the conductive adhesive layer 20 , and an insulating layer 40 laminated on the shielding layer 30 .
[0087] In addition, a plurality of openings 50 are formed in the shield layer 30 .
[0088] (conductive adhesive layer)
[0089] In the electromagnetic wave shielding film 10 , the conductive adhesive layer 20 only needs to have conductivity and function as an adhesive, and may be made of any material.
[0090] F...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| area | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
Login to View More
Abstract
An object of the present invention is to provide an electromagnetic wave shielding film having sufficient folding resistance and sufficiently high electromagnetic wave shielding properties. The electromagnetic wave shielding film of the present invention includes a conductive adhesive layer, a shielding layer laminated on the conductive adhesive layer, and an insulating layer laminated on the shielding layer, and is characterized in that: A plurality of openings, the electromagnetic wave shielding film can be bent 600 times in the MIT folding strength fatigue test stipulated in JIS P8115:2001 without breaking the wire, and the frequency of the electromagnetic wave shielding film measured by the KEC method is 200MHz The electromagnetic wave shielding characteristic is above 85dB.
Description
technical field [0001] The invention relates to an electromagnetic wave shielding film, a shielding printed circuit board and electronic equipment. Background technique [0002] Conventionally, electromagnetic waves from the outside have been shielded by, for example, pasting an electromagnetic wave shielding film on a printed circuit board such as a flexible printed circuit board (FPC). [0003] An electromagnetic wave shielding film is generally formed by laminating a conductive adhesive layer, a shielding layer made of a metal thin film, etc., and an insulating layer in this order. The shielding printed circuit board is produced by hot pressing the electromagnetic wave shielding film and the printed circuit board in a state where the electromagnetic wave shielding film is bonded to the printed circuit board through an adhesive layer. After bonding, the components are mounted on the printed circuit board by solder reflow. In addition, the printed wiring board has a struc...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & AuthorityPatents(China)
IPC IPC(8): H05K9/00B32B3/18B32B7/025B32B15/08B32B15/20
CPCB32B3/18B32B7/02B32B15/08B32B15/20H05K9/00H05K9/0084H05K9/0088H05K1/0218
Inventor上农宪治山内志朗白发润村川昭
OwnerTATSUTA ELECTRICWIRE & CABLE