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Liquid metal conductive paste and electronic devices

A technology of liquid metal and conductive paste, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, electrical components, metal processing equipment, etc., can solve the problem of bending resistance, stretch resistance, and flexible electronic products. And other issues

Active Publication Date: 2020-06-09
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The inventors found that such composite liquid metal conductive pastes are generally difficult to have good bending resistance and stretch resistance characteristics, and cannot meet the requirements of flexible electronic products for the flexibility (such as bending resistance, stretch resistance, etc.) of liquid metal conductive pastes after forming. , twist resistance) high requirements

Method used

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  • Liquid metal conductive paste and electronic devices
  • Liquid metal conductive paste and electronic devices
  • Liquid metal conductive paste and electronic devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] An embodiment of the present invention provides a liquid metal conductive paste, specifically, the liquid metal conductive paste includes: liquid metal microcapsules, the capsule wall of the liquid metal microcapsules is a coating polymer, and the capsule core is liquid metal; the base polymer ; Conductive powder; Solvent; Wherein, the melting point of the liquid metal satisfies: at least when the conductive circuit made of the liquid metal conductive paste is deformed, the liquid metal is in a liquid state.

[0044] It should be noted that the above-mentioned "the melting point of the liquid metal satisfies: at least when the conductive circuit made of liquid metal conductive paste is deformed, the liquid metal is in a liquid state" includes a variety of situations: first, the normal use of the conductive circuit ( That is, no obvious deformation) the temperature T1 is the same as the temperature T2 when it deforms, then the melting point of the liquid metal should be l...

Embodiment 2

[0080] In order to further improve the bending resistance of the conductive circuit made of the liquid metal conductive paste, an embodiment of the present invention also provides a liquid metal conductive paste as described below, the liquid metal conductive paste includes:

[0081] Liquid metal microcapsules, the walls of the liquid metal microcapsules are covered with polymers, and the capsule core is liquid metal;

[0082] base polymer;

[0083] Conductive powder;

[0084] solvent;

[0085] crosslinking agent;

[0086] Wherein, the melting point of the liquid metal satisfies: at least when the conductive circuit made of the liquid metal conductive paste is deformed, the liquid metal is in a liquid state; the crosslinking agent is used in the solidification process of the conductive circuit made of the liquid metal conductive paste The coating polymer and / or the base polymer undergoes a cross-linking reaction to form a body-shaped network structure.

[0087] The reasons...

Embodiment 3

[0110] An embodiment of the present invention provides an electronic device, the electronic device includes a conductive circuit, and the conductive circuit is made of the liquid metal conductive paste described in any one of the above items. The above-mentioned electronic devices can be flexible sensors, wearable devices, flexible electronic tags, FPC circuit boards and other electronic devices that require the use of conductive circuits, and are especially suitable for electronic devices that require flexible conductive circuits.

[0111] The embodiment of the present invention also provides a method for preparing a liquid metal conductive paste, which is used to prepare the liquid metal conductive paste described in any one of the above, specifically, as Figure 6 as shown, Figure 6 The flow chart of the preparation method of the liquid metal conductive paste provided by the embodiment of the present invention, the preparation method of the liquid metal conductive paste in...

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Abstract

The invention provides a liquid metal conductive paste and an electronic device, and relates to the technical field of new materials. In terms of weight percentage, the liquid metal conductive paste provided by the present invention includes 1%~50% liquid metal microcapsules, 30%~80% conductive powder, 1%~25% basic polymer and 10%~40% solvent; Wherein, the capsule wall of the liquid metal microcapsule is coated polymer, and the capsule core is liquid metal; the melting point of the liquid metal satisfies: at least when the conductive circuit made of the liquid metal conductive paste is deformed, The liquid metal is in a liquid state. The technical solution of the invention can make the conductive circuit have better flexibility.

Description

technical field [0001] The invention relates to the technical field of new materials, in particular to a liquid metal conductive paste and an electronic device. Background technique [0002] In recent years, with the rapid development of electronic information technology, the market has increasingly stringent requirements on the specificity and functionality of liquid metal conductive paste. In order to meet the above requirements, the liquid metal conductive paste has gradually developed from a single material such as metal and carbon to a composite liquid metal conductive paste. Composite liquid metal conductive paste is mostly made of solid conductive media and carrier substances, for example, conductive particles such as silver powder, copper powder, carbon powder, graphene, etc. and epoxy resin, acrylic resin, polyurethane resin, vinyl chloride-vinyl acetate Composite with copolymer resin, silicone resin, etc. [0003] The inventors found that such composite liquid me...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B1/24H01B13/00B22F1/02B22F1/00
CPCB22F1/0003H01B1/22H01B1/24H01B13/00B22F1/16
Inventor 李平董仕晋门振龙
Owner BEIJING DREAM INK TECH CO LTD
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