Surface consistency packaging LED display unit based on mold pressing technology

A display unit and consistency technology, applied in electrical components, identification devices, instruments, etc., can solve problems such as difficulties in mass production, poor surface consistency of LED displays, and poor ink color consistency

Inactive Publication Date: 2020-02-14
长春希龙显示技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional SMD technology is limited by the difficulty of mass production when the size of the lamp bead is 1mm or less. The corresponding COB technology has natural advantages in small-pitch display, but the difficulty of LED display technology based on COB packaging lies in the control surface The consistency of the adhesive layer and the consistency of the ink color are affected by the plate, the ink color of the plate, the thickness of the adhesive layer, and the color consistency of the adhesive layer itself. The surface consistency and ink color consistency of the LED display are poor

Method used

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  • Surface consistency packaging LED display unit based on mold pressing technology
  • Surface consistency packaging LED display unit based on mold pressing technology
  • Surface consistency packaging LED display unit based on mold pressing technology

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Experimental program
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Embodiment 1

[0025] Such as figure 1 As shown, the surface consistent packaging LED display unit based on molding technology of the present invention includes a circuit board 1 with LED light-emitting chips 2 fixed thereon, a first packaging adhesive layer 3, a second packaging adhesive layer 4, and a release film layer 5; The first encapsulation adhesive layer 3 is prepared on the surface of the circuit board 1 with the LED light emitting chip fixed thereon, the second encapsulation adhesive layer 4 is prepared on the first encapsulation adhesive layer 3 , and the release film layer 5 is pressed on the second encapsulation adhesive layer 4 surface; the first encapsulation adhesive layer 3 is an epoxy resin AB adhesive layer mixed with 10% to 60% by weight scattering agent, and its thickness is 0.15-0.3mm; the second encapsulation adhesive layer 4 is mixed with 10% to 60% % weight ratio of scattering agent and 3-10‰ amount ratio of epoxy resin adhesive layer of melanin, the thickness of wh...

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Abstract

The invention relates to a surface consistency packaging LED display unit based on a mold pressing technology, which comprises a circuit board fixedly provided with an LED light-emitting chip, and a first packaging adhesive layer prepared on the surface of the circuit board fixedly provided with the LED light-emitting chip. The surface consistency packaging LED display unit based on a mold pressing technology is characterized by further comprising a second packaging adhesive layer, the second packaging adhesive layer is prepared on the first packaging adhesive layer, the first packaging adhesive layer is an epoxy resin AB adhesive layer mixed with 10%-60% of a scattering agent by weight, and the thickness is 0.15-0.3 mm; and the second packaging adhesive layer is an epoxy resin adhesive layer mixed with 10%-60% of a scattering agent by weight and 0.3%-1% of melanin, and the thickness is 0.1-0.2 mm. The transmittance and the brightness are high, and the surface consistency of the wholepackaging unit can be ensured under the condition that the brightness is not lost.

Description

technical field [0001] The invention belongs to the technical field of high-density LED display screens, and relates to a surface consistent packaging LED display unit based on molding technology. Background technique [0002] With the continuous development of LED display technology, MINI LED Mirco LED occupies the hot spots of various news. All display related manufacturers are aware of the future development trend and conduct in-depth research on this. At the same time, industrial technologies related to display screens, such as crystal bonding equipment Accuracy and recognition capabilities, circuit board process capabilities, and LED light-emitting chip technology are also developing rapidly, all of which promote the overall improvement of LED display technology. Traditional SMD technology is limited by the difficulty of mass production when the size of the lamp bead is 1mm or less. The corresponding COB technology has natural advantages in small-pitch display, but the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/52H01L33/58G09F9/33
CPCG09F9/33H01L33/52H01L33/56H01L33/58H01L2933/005H01L2933/0058
Inventor 马新峰段健楠刘臣赵国惠韩悦
Owner 长春希龙显示技术有限公司
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