A substrate drying apparatus and method
A drying device and drying method technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of large amount of drying liquid, easy to produce crystallization, high price, reduce fire occurrence, improve safety, The effect of reducing dosage
Pending Publication Date: 2020-02-21
SUZHOU KZONE EQUIP TECH
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Problems solved by technology
[0003] However, using the existing conventional drying methods, there are problems such as the large amount of dry liquid (IPA), the need for explosion-proof design of the plant, and high operating costs
[0004] In some cases, non-flammable solvents such as hydrofluoroether (HFE) are used, however, the disadvantages are also obvious, that is, its price is higher than that of alcohol drying solvents, and the post-processing cost is high. In addition, HFE is not miscible with water , and prone to crystallization, not suitable for water-based cleaning
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[0060] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0061] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the pointed device or element must have a specific orientation or a ...
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The present invention relates to a substrate drying apparatus, comprising: a chamber; a spraying unit, wherein the spraying unit is arranged in the chamber; a supply unit I that is connected with thespraying unit and used for supplying dry liquid; a pressure reducing unit that is connected with the chamber through a pressure reducing pipeline and used for reducing the air pressure; and a supply unit II that is connected with the chamber and used for supplying inert gas or compressed air. The invention also provides a substrate drying method, which comprises the following steps: loading a substrate to be processed into the chamber, and wherein a cleaning solution exists on the surface of the substrate; spraying dry liquid to the surface of the substrate; stopping spraying the dry liquid when the cleaning solution is replaced by the dry liquid; exhausting and reducing the pressure in the chamber until a set pressure value is reached; recovering the air pressure in the chamber when the dry liquid on the surface of the substrate is evaporated; removing the substrate from the chamber. By using the apparatus, the use amount of dry liquid is reduced, and higher safety is achieved.
Description
Technical field [0001] The invention relates to a substrate drying device and also to a substrate drying method. Background technique [0002] In the panel field, glass substrates, masks, or wafers in the semiconductor field need to be immersed in DIW (deionized water) or rinsed by spraying. After rinsing, there will be excessive DIW on the surface of the product, causing water stains. According to the existing conventional drying method, the object to be treated is immersed in a container containing a dry liquid (isopropanol, abbreviated as IPA). When the processed product is taken out from the container, the surface tension difference between the dry liquid (IPA) and the DIW is used to peel off the DIW on the surface of the product, and then the solvent on the surface of the product is evaporated in the atmosphere by air knife blowing or the like. The purpose of drying. [0003] However, with the existing conventional drying methods, there are problems such as a large amount o...
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Login to View More IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02057H01L21/67034
Inventor蒋新沈宗豪施利君
OwnerSUZHOU KZONE EQUIP TECH