Liquid cooling device and electronic equipment

A liquid cooling and liquid cooling tube technology, applied in the field of liquid cooling devices and electronic equipment, can solve the problems of restricting the improvement of the heat dissipation effect of the liquid cooling tube, and achieve the effects of improved heat dissipation effect, improved heat dissipation effect and good fluidity.

Active Publication Date: 2020-05-22
维沃移动通信(重庆)有限公司
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  • Abstract
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Problems solved by technology

[0005] The invention discloses a liquid cooling device and electronic equipment to solve the problem that the current liquid cooling tube restricts the improvement of the heat dissipation effect of the liquid cooling tube due to the contradiction between the fluidity of the cooling medium itself and the filling amount of the cooling medium.

Method used

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  • Liquid cooling device and electronic equipment
  • Liquid cooling device and electronic equipment
  • Liquid cooling device and electronic equipment

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Embodiment Construction

[0024] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0026] Please refer to Figure 1-Figure 6 As shown, the embodiment of the present invention discloses a liquid cooling device, and the disclosed liquid cooling device includes a cooling medium,...

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Abstract

The invention discloses a liquid cooling device and electronic equipment. The liquid cooling device comprises a cooling medium, a liquid cooling pipe, a driving mechanism and a stirring mechanism; thecooling medium is arranged in the pipe cavity of the liquid cooling pipe; the liquid cooling pipe is provided with a guide through hole, and the guide through hole is communicated with a pipe cavityof the liquid cooling pipe; the stirring mechanism comprises a stirring rod; and the stirring rod is provided with a first end and a second end, the first end of the stirring rod is located in a pipecavity of the liquid cooling pipe, the second end of the stirring rod penetrates through the guide through hole and is connected with the driving mechanism, and the driving mechanism drives the stirring rod to move relative to the pipe cavity of the liquid cooling pipe. According to the scheme, the problem that the improvement of the heat dissipation effect of an existing liquid cooling pipe is restricted due to the contradiction between the liquidity of a cooling medium and the filling amount of the cooling medium can be solved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a liquid cooling device and electronic equipment. Background technique [0002] With the rapid development of mobile phone performance, it is no longer limited to simple communication functions, but also has other application functions such as work and entertainment to meet people's work and entertainment needs; Over time, some large-scale applications are prone to mobile phone heating, especially in the process of running mobile games, the high-load operation of the mobile phone chip causes serious heating of the mobile phone chip itself, which not only affects the operating ability of the chip itself, but also causes the running program to freeze. In addition, the overheating of the mobile phone will cause the mobile phone to automatically shut down, which will seriously affect the user experience. [0003] In order to solve the heat dissipatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20272
Inventor 郑小骏
Owner 维沃移动通信(重庆)有限公司
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