A kind of aluminum substrate foil plate pressing device

A pressing device and aluminum substrate technology, which is applied in the lamination device, lamination, transportation and packaging, etc., can solve problems such as inaccurate lamination, and achieve the effect of improving production efficiency and accuracy

Active Publication Date: 2021-12-21
山西鼎隆智装科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a laminating device for aluminum substrate and foil plate, which solves the problem of inaccurate lamination between aluminum substrate and copper foil

Method used

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  • A kind of aluminum substrate foil plate pressing device
  • A kind of aluminum substrate foil plate pressing device
  • A kind of aluminum substrate foil plate pressing device

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Embodiment Construction

[0030] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0031] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", The orientation or positional relationship indicated by "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have Certain orientations, constructed and operative in certain orientations, therefore are not t...

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Abstract

The present invention relates to the field of production and processing of aluminum substrates, in particular to an aluminum substrate foil lamination device, comprising a positioning table, a feeding assembly for feeding aluminum substrates, a transmission assembly for feeding copper foil, a lamination assembly, an outlet Material conveyor belt and four first photoelectric sensors for positioning and pressing between the aluminum substrate and copper foil, the positioning platform is set between the feeding assembly and the conveying assembly, and the feeding direction of the feeding assembly is perpendicular to the feeding of the conveying assembly direction, the pressing assembly is arranged on the side of the transmission assembly, the four first photoelectric sensors are all arranged on the pressing assembly, and the positioning platform and the transmission assembly are also provided with four corresponding to each first photoelectric sensor. 2. Photoelectric sensor, the feeding assembly includes a feeding conveyor belt. The invention solves the problem of inaccurate lamination between the aluminum substrate and the copper foil, improves the accuracy of the lamination of the aluminum substrate and the copper foil, and improves the Substrate production efficiency.

Description

technical field [0001] The invention relates to the field of production and processing of aluminum substrates, in particular to an aluminum substrate foil plate pressing device. Background technique [0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided panel consists of three layers, which are circuit layer (copper foil), insulating layer and metal base layer. It is commonly used in LED lighting products and has two sides. , the white side is for soldering the LED pins, and the other side shows the natural color of aluminum. Generally, it will be in contact with the heat-conducting part after applying the heat-conducting slurry. The product items cover the whole industry of lighting products, such as commercial lighting, indoor lighting, the application range is getting bigger and bigger, and the use and economic value are getting bigger and bigger. [0003] High thermal conductivity aluminum substra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B37/00B32B38/18B32B15/01B65G47/52B65G47/90H05K3/02
CPCB32B37/10B32B37/0046B32B38/1833B32B15/017B65G47/52B65G47/90H05K3/022
Inventor 陈庆祝
Owner 山西鼎隆智装科技股份有限公司
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