A kind of electroplating tin additive and its preparation method and use method

An additive and electroplating tin technology, applied in the field of electroplating tin additives and its preparation, can solve the problems of high tank changing frequency, low safety, low production efficiency, etc., and achieve extended tank life, excellent electroplating performance, and good anti-oxidation effect. Effect
CN111472027BActive Publication Date: 2020-12-25GUANGDONG HAFU SCI & TECH
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
GUANGDONG HAFU SCI & TECH
Publication Date
2020-12-25

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Abstract

The invention discloses an electro-tinning additive. Water serves as a solvent, the electro-tinning additive comprises following components including, by concentration, 0.2-20 g / L of 1-phenyl-2-pentanone, 0.2-20 g / L of 1-(3,4-dyhydroxy phenyl)-1-pentanone, 0.2-20 g / L of naphthol ethoxy sulfonic acid, 1-20 g / L of resorcinol, 1-20 g / L of antioxidant and 1-30 g / L of brightener. By means of the electro-tinning additive, generation of bubbles in the electroplating process can be effectively reduced, oxygen dissolving is reduced, and the electroplating effect is guaranteed.
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Description

technical field

[0001] The invention relates to the technical field of electroplating, in particular to an electroplating tin additive and a preparation method and application method thereof. Background technique

[0002] Printed Circuit Board (PCB) is one of the important parts of the electronics industry and is the support of electronic components. Generally, the process of manufacturing printed circuit boards includes double-sided copper cladding β†’ mechanical processing β†’ copper sinking β†’ film (screen printing) β†’ electroplating copper β†’ electrotin plating β†’ etching β†’ stripping tin β†’ processing. Traditional electroplating tin additives are developed based on gantry wire electroplating. However, compared with VCP lines, gantry wires have lower production efficiency, higher cost, and lower safety. However, the application of traditional tin plating additives to VCP lines faces the following two problems: 1) The electroplating process A large number of air bubbles will be pr...

Claims

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