Device for testing thermal expansion coefficient of micro sample by using nano-mechanical tester

A technology of thermal expansion coefficient and tester, which is applied in the direction of material thermal expansion coefficient, etc., can solve the problems of not having the function of thermal expansion coefficient test, unable to realize free expansion, and unable to realize thermal expansion coefficient measurement, etc.

Pending Publication Date: 2020-09-11
XI AN JIAOTONG UNIV
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Problems solved by technology

However, the nanomechanical tester does not have the function of measuring the thermal expansion coefficient, and its original high-temperature device cannot realize the free expansion of the sample during the heating process, that is, the measurement of the thermal expansion coefficient cannot be realized. Therefore, there is an urgent need for a nanomechanical tester. Apparatus for testing the coefficient of thermal expansion

Method used

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  • Device for testing thermal expansion coefficient of micro sample by using nano-mechanical tester
  • Device for testing thermal expansion coefficient of micro sample by using nano-mechanical tester

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Embodiment Construction

[0017] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0018] The device of the present invention is used in conjunction with Histrotron (now Bruker) TI 950 nanomechanical tester and xSol800 high temperature platform.

[0019] see figure 2 , the present invention is a device for testing the thermal expansion coefficient of a nanomechanical tester, including: a silicon wafer 6, a supporting object 4, high-temperature glue and a specially designed sample.

[0020] Sample 3 was fixed on silicon wafer 6 with high temperature glue.

[0021] Select a support object 4 with a suitable size, the upper and lower surfaces are as flat as possible, and its height is greater than the height of the sample 3 after expansion.

[0022] Place the supporting object 4 on the silicon wafer 6 (in order to make the whole system more stable, place it symmetrically with the sample as the center as far as possible), and keep a certain d...

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Abstract

A device for testing the thermal expansion coefficient of a micro sample by using a nano-mechanical tester comprises a lower heating table and an upper heating table. A silicon wafer is arranged on the upper surface of the lower heating table, a sample is placed on the upper surface of the center of the silicon wafer, supporting objects are arranged on the outer side of the sample on the upper surface of the silicon wafer, the upper heating table is arranged at the top of the supporting objects, a gap is reserved between the two parts of the upper heating table located above the sample, the upper heating table is of a hollow structure, and a pressing head penetrates through the gap and is located above the sample. The device combines a nano-mechanical tester and a high-temperature table, so that the thermal expansion coefficient is measured by utilizing the nano-mechanical tester, and the application of the nano-mechanical tester is expanded.

Description

technical field [0001] The invention relates to the technical field of thermal performance evaluation of solid materials, in particular to a device for testing the coefficient of thermal expansion of tiny samples using a nanomechanical tester. Background technique [0002] Thermal expansion and contraction of objects are ubiquitous in nature. The main parameter to measure the thermal expansion of an object is the coefficient of thermal expansion of the materials that make up the object. The thermal expansion coefficient of a material is one of the basic thermophysical parameters of a substance and an important characteristic quantity that characterizes the properties of a material. Accurately measuring the thermal expansion coefficient of materials is of great significance for basic scientific research, technological innovation, and engineering applications. At present, there are many testing methods for the thermal expansion coefficient of materials, such as dial gauge me...

Claims

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Application Information

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IPC IPC(8): G01N25/16
CPCG01N25/16
Inventor 秦元斌张朋诚解德刚付琴琴单智伟刘南君
Owner XI AN JIAOTONG UNIV
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