Dustproof server case

A server, dust-proof technology, applied in the field of dust-proof server chassis, can solve the problems such as poor dust-proof effect

Inactive Publication Date: 2020-10-20
孔磊
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiment of the present invention is to provide a dust-proof se

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dustproof server case
  • Dustproof server case
  • Dustproof server case

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0020] The specific implementation of the present invention will be described in detail below in conjunction with specific embodiments.

[0021] like figure 1 As shown, it is a structural diagram of a dust-proof server case provided by an embodiment of the present invention, including a case main body 1 and a cooling device 16. The top of the case main body 1 is connected to a casing 3 through a partition 2, and the inside of the casing 3 is empty. Cavity structure, one side of the casing 3 is provided with a fan 5, one side of the fan 5 is provided with a purification box 7, and the purification ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention is applicable to the technical field of electronic equipment, and particularly relates to a dustproof server case. According to the dustproof server case provided by the embodiment of the invention, the sucked air is subjected to water passing to remove dust mixed in the air, and then the water-passing air is dried through a drying agent. The server case is simple in structure and reasonable in design, dust can be highly purified, the dustproof capacity of the server case is greatly improved, and normal work of a server is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of electronic equipment, in particular to a dust-proof server case. Background technique [0002] A server is a type of computer that runs faster, loads more heavily, and is more expensive than a normal computer. The server provides computing or application services for other clients (such as PCs, smart phones, ATMs and other terminals or even large-scale equipment such as train systems) in the network. The server has high-speed CPU computing capability, long-term reliable operation, powerful I / O external data throughput and better scalability. According to the services provided by the server, generally speaking, the server has the ability to respond to service requests, undertake services, and guarantee services. As an electronic device, the server has a very complicated internal structure, but it is not much different from the internal structure of an ordinary computer, such as: cpu, hard disk, memory, s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06F1/18B01D47/02B01D53/26
CPCB01D47/02B01D53/26B01D2247/04G06F1/181
Inventor 孔磊
Owner 孔磊
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap