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Thermal diode and processing method thereof

A technology of thermal diodes and processing methods, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating retrofits, etc., to achieve the effect of protecting important components, wide application range and remarkable effect

Active Publication Date: 2020-11-06
GUANGZHOU UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The effect of one-way heat transfer cannot be achieved in the horizontal direction

Method used

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  • Thermal diode and processing method thereof
  • Thermal diode and processing method thereof

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Embodiment Construction

[0024] This part will describe the specific embodiment of the present invention in detail, and the preferred embodiment of the present invention is shown in the accompanying drawings. Each technical feature and overall technical solution of the invention, but it should not be understood as a limitation on the protection scope of the present invention.

[0025] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

[0026] I...

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Abstract

The invention discloses a thermal diode. The thermal diode comprises a holder, a steam channel, liquid channels and an one-way conduction assembly; one end of the holder is an evaporation section, andthe other end of the holder is a condensation section; the steam channel is arranged in the retainer, one end of the steam channel extends to the evaporation section, and the other end of the steam channel extends to the condensation section; the liquid channels are arranged on the two sides of the steam channel, one end of each liquid channel extends to the evaporation section, and the other endof each liquid channel extends to the condensation section; the one-way conduction assembly is arranged in the steam channel and controls the steam channel to be in one-way conduction in the direction from the evaporation section to the condensation section. According to the thermal diode, the evaporation section is arranged to be in butt joint with the fever element, the condensation section isarranged to be in butt joint with the heat dissipation element to achieve the basic function of a heat pipe, and the steam channel and the liquid channel are arranged to achieve the circulating heat transfer effect; therefore, internal steam can only flow along one direction on the premise that the thermal diode works in any direction, and the effect of protecting important elements is achieved.

Description

technical field [0001] The invention relates to the technical field of heat pipe design and processing, in particular to a thermal diode and a processing method thereof. Background technique [0002] As an efficient heat transfer element, heat pipes are widely used in the field of heat dissipation of electronic products. However, since common heat pipes can transfer heat in two directions, the transfer is based on the direction of temperature difference, that is, from high temperature to low temperature. It is because of this bidirectionality that when an accident occurs, the temperature of the heat dissipation section may be higher than that of the electronic device, and then the external heat will be transferred to the electronic device, which will cause damage to the device. [0003] Therefore, thermal diodes were invented and applied. Thermal diodes, as the name implies, are like diodes that only allow heat to flow in one direction, and do not allow heat pipes to flow ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02H05K7/20B22F3/11B22F7/00
CPCB22F3/11B22F7/004F28D15/02H05K7/20309H05K7/20318H05K7/20336
Inventor 向建化邓亮明周超刘泽宇陈稀波陈从桂
Owner GUANGZHOU UNIVERSITY
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