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Radio wave-absorbing laminate film, production method therefor, and element including same

A radio wave absorption and manufacturing method technology, applied in the direction of electrical components, chemical instruments and methods, circuits, etc., can solve problems such as malfunction, electronic equipment failure, etc., and achieve excellent reflection attenuation, excellent transmission attenuation, and good radio wave absorption performance Effect

Pending Publication Date: 2021-01-08
THE UNIV OF TOKYO +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the expansion of the use of radio waves in high-frequency bands may lead to failures and malfunctions of electronic equipment due to interference between electronic components.

Method used

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  • Radio wave-absorbing laminate film, production method therefor, and element including same
  • Radio wave-absorbing laminate film, production method therefor, and element including same
  • Radio wave-absorbing laminate film, production method therefor, and element including same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0214] [Preparation of the radio wave absorbing laminated film of Example 1 and the laminated films of Comparative Examples 1 to 3]

[0215] (Preparation of paste for radio wave absorbing layer formation)

[0216] 35.1 mass % of the following ε-type iron oxide, 2.2 mass % of the following carbon nanotube (CNT), 3.5 mass % of the following dispersant, and 8.3 mass % of the following resin were added to 50.9 mass % of TMU, and each component was uniformly dissolved or dispersed to obtain a paste for forming a radio wave absorbing layer.

[0217] In addition, the solid content concentration of the paste for radio wave absorbing layer formation was 49.1 mass %.

[0218] ε-Ga is used as ε-type iron oxide 0.45 Fe 1.55 o 3 . The average particle size of the ε-type iron oxide is not less than 20 nm and not more than 30 nm.

[0219] As CNT, a multiwalled carbon nanotube having a major diameter of 150 nm (trade name VGCF-H; manufactured by Showa Denko Co., Ltd.) was used.

[0220...

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Abstract

Provided are: a radio wave-absorbing laminate film in which both the top surface and the bottom surface have superior transmission attenuation properties and reflection attenuation capabilities in extremely high-frequency wave bands and higher, and exhibit excellent radio wave absorption properties even when designed to be extremely thin; a production method for the film; and an element that contains the film. A radio wave-absorbing laminate film having radio wave-absorbing layers, wherein the radio wave-absorbing laminate film comprises a center layer, two substrate layers, and two radio wave-absorbing layers, the center layer containing at least one metal layer, and the two substrate layers being laminated on both surfaces of the center layer. With regard to each of the two substrate layers, the radio wave-absorbing layer is laminated on the surface opposite to the center layer, and, the two substrate layers may be the same or different, the two radio wave-absorbing layers may be thesame or different, and at least one of the radio wave-absorbing layers contains a magnetic body.

Description

technical field [0001] The present invention relates to a radio wave absorbing laminated film having excellent transmission attenuation properties and reflection attenuation properties at the millimeter-wave band or higher on the surface and the back surface, and exhibiting good radio wave absorption performance even with an extremely thin design, a method for producing the film, and a film comprising the film. elements of the membrane. Background technique [0002] Radio waves in high-frequency bands are widely used in various information and communication systems such as mobile phones, wireless LANs, ETC systems, advanced road traffic systems, car driving auxiliary road systems, and satellite broadcasting. However, the expansion of the use of radio waves in high-frequency bands may lead to malfunctions and malfunctions of electronic equipment due to interference between electronic components. As a countermeasure against such a problem, a method of absorbing unnecessary ra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00B32B15/04C01G49/00H01F1/34H01F1/37
CPCH05K9/0088H05K9/0075C01G49/06C01P2004/64C01P2004/62C01P2006/42B32B7/12B32B27/308B32B15/08B32B27/18B32B27/34B32B25/08B32B2307/208B32B2307/732B32B27/286B32B27/302B32B27/285B32B27/42B32B23/08B32B15/088B32B27/325B32B15/082B32B27/38B32B27/32B32B27/281B32B25/14B32B27/22B32B2250/40B32B27/365B32B2457/00B32B27/36B32B15/20B32B2605/00B32B2250/05B32B2264/102B32B15/09B32B15/085B32B27/08H01F1/348H01F1/37H05K9/0084B32B15/04C01G49/00B32B7/025B32B2311/30H01F1/34
Inventor 大越慎一生井飞鸟吉清麻里绘浅井隆宏桑原大
Owner THE UNIV OF TOKYO