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Room-temperature-curable organopolysiloxane composition and protective agent or adhesive composition for electric/electronic components

A polysiloxane, room temperature curing technology, applied in the field of electrical and electronic equipment, can solve problems such as insufficient curing speed, achieve excellent reliability/durability, maintain reliability/durability, and easy curing

Pending Publication Date: 2021-10-15
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the room-temperature-curable silicone rubber composition disclosed in Patent Document 2 has insufficient curing speed at room temperature, and there is still room for improvement in adhesiveness to various substrates.

Method used

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  • Room-temperature-curable organopolysiloxane composition and protective agent or adhesive composition for electric/electronic components
  • Room-temperature-curable organopolysiloxane composition and protective agent or adhesive composition for electric/electronic components
  • Room-temperature-curable organopolysiloxane composition and protective agent or adhesive composition for electric/electronic components

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0119] Method for preparing the composition

[0120] The room temperature curable organopolysiloxane composition of the present invention can be formulated by mixing the above-mentioned components, for example, in the case of solution (I), by mixing component (A), component (C) and Any other components are used for deployment. And, if necessary, by mixing component (C), optional alkoxysilane, etc. component (D), and after treating the surface of component (C) with component (D), mixing component (A) is carried out Adjustment.

[0121] In the case of solution (II), after mixing component (B), component (C), component (D), and treating the surface of component (C) with component (D), by mixing component (E ), component (F) and any other components for deployment.

[0122] Such a mixing device is not particularly limited, and examples include: a single-shaft or twin-shaft continuous mixer, a two-roll mixer, a Ross (Ross) mixer, a Hobart mixer, a tooth mixer (dental mixer), a p...

Embodiment 1

[0167] Weigh 37.5 parts by mass of component (A-1) and 62.5 parts by mass of component (A-2), and uniformly mix 10 parts by mass of component (C-1) over 90 minutes to obtain a room temperature curable organopolysiloxane composition solution (I) of the substance.

[0168] Next, 10 parts by mass of component (C-1) were uniformly mixed in 94.5 parts by mass of component (B-1) over 90 minutes. 1.9 parts by mass of component (D-1), 2.0 parts by mass of component (D-2), 0.10 parts by mass of component (E-1) and 1.5 parts by mass of component (F -1) Obtaining a solution (II) of a room temperature curable organopolysiloxane composition.

[0169] After curing the above-mentioned room-temperature-curable organopolysiloxane composition at 25° C. for 7 days, and then mixing the solution (I) and the solution (II) at the same mass, the viscosity, pot life, and adhesiveness were measured.

Embodiment 2

[0171] In the same manner as in Example 1, room temperature curable Organopolysiloxane composition solution (I) and solution (II).

[0172] After curing the above-mentioned room-temperature-curable organopolysiloxane composition at 25° C. for 7 days, and then mixing the solution (I) and the solution (II) at the same mass, the viscosity, pot life, and adhesiveness were measured.

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Abstract

The invention relates to a curable organopolysiloxane composition that is easily cured at room temperature and has excellent adhesiveness to various substrates, and also relates to provide a protective agent or an adhesive composition for electric / electronic components that includes the organopolysiloxane composition, and an electric / electronic device in which an electric / electronic component is encapsulated or sealed with the curable organopolysiloxane composition. A multicomponent room-temperature-curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane having a molecular chain terminal blocked with a hydroxysilyl group, (B) a diorganopolysiloxane having a molecular chain terminal blocked with an alkoxysilyl group, (C) a functional filler, (D) a compound having two or more alkoxy groups bonded to a silicon atom in one molecule, and (E) a catalytic amount of a catalyst for condensation reaction, the aforementioned compounds being individually stored, and also the use of the multicomponent room-temperature-curable organopolysiloxane composition are provided.

Description

technical field [0001] The present invention relates to a curable organopolysiloxane composition that is more easily cured at room temperature and has excellent adhesion to various substrates, and also relates to electric and electronic parts formed from the curable organopolysiloxane composition A protective agent or adhesive composition, an electrical and electronic device for encapsulating or sealing electrical and electronic components through this curable organopolysiloxane composition. Background technique [0002] Curable organopolysiloxane compositions are widely used as protective agent compositions for electrical and electronic components, but from the viewpoint of reliability and durability as protective materials, they need to exhibit excellent self-adhesive. For example, Patent Document 1 proposes a hydrosilylation-curable curable organopolysiloxane composition comprising an organopolysiloxane having specific alkoxysilyl groups and alkenyl groups in one molecul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K5/541C08K5/544C08L83/06
CPCC08G77/18C08G77/16C08L83/04C08L83/00C08K3/36C08K5/5419C08G77/08C08K5/5435C08K5/544C08K9/04C08K2201/003C08K2201/006C08K2201/014C08L2203/206C08L2205/025C08L2205/03
Inventor 太田健治
Owner DOW TORAY CO LTD
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