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Automatic testing device of semiconductor device

An automated testing and semiconductor technology, which is applied to measuring devices, parts and instruments of electrical measuring instruments, etc., and can solve the problems of cumbersome detection of refrigeration chips.

Active Publication Date: 2021-11-23
NANTONG HONGJINBEI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an automatic testing device for semiconductor devices, which solves the problem that the traditional semiconductor refrigerating sheet is very cumbersome in testing during factory production, and it may need to be replaced when facing refrigerating sheets of different sizes. Problems with different specifications of test fixtures

Method used

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  • Automatic testing device of semiconductor device
  • Automatic testing device of semiconductor device
  • Automatic testing device of semiconductor device

Examples

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Embodiment

[0038] like Figure 1-13 As shown, an automated testing device for a semiconductor device includes a chassis 1, a conductive socket 9 is provided on one side of the chassis 1, a conductive component 8 and a current output control component 5 are arranged inside the upper side of the chassis 1, and the chassis 1 One side of 1 is fixedly connected to a temperature measuring box 2, and a digital display thermometer 4 is fixedly installed on the upper side of the temperature measuring box 2, and a water tank 3 is fixedly connected to the side of the chassis 1 close to the temperature measuring box 2, and inside A temperature guide assembly 7 is provided, a fixed assembly 6 is fixedly installed inside the cabinet 1, a conduction assembly 8 is fixedly installed inside the upper side of the cabinet 1, two electric push rods 610 are fixedly installed inside the cabinet 1, two The output ends of the electric push rods 610 are respectively fixedly connected with a docking assembly 611, ...

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Abstract

The invention relates to the technical field of semiconductor devices, in particular to an automatic testing device of a semiconductor device, which comprises a case, a conduction assembly and a current output control assembly are arranged in the upper side of the case, a temperature measuring box is fixedly connected to one side of the case, and a water tank is fixedly connected to one side, close to the temperature measuring box, of the case. A temperature conduction assembly is arranged in the water tank, a fixing assembly is fixedly installed in the case, and a conduction assembly is fixedly installed in the upper side of the case. Two electric push rods are fixedly installed in the case, the output ends of the two electric push rods are fixedly connected with butt joint assemblies correspondingly, so that a user can adjust the two butt joint assemblies by controlling the electric push rods, and then power-on butt joint operation can be conducted on refrigeration pieces of different specifications; a first electric-conducting rod is fixedly connected with the inner of a fixing ring, therefore, the first electric-conducting rod can be in butt joint with the refrigeration pieces for electric conduction without frequently replacing detection equipment.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to an automatic testing device for semiconductor devices. Background technique [0002] Refrigeration sheet is also called thermoelectric semiconductor refrigeration component, Peltier, etc. It refers to a patch that is divided into two sides, one side absorbs heat, the other side dissipates heat, and acts as a heat conduction patch. It can both cool and heat. The cooling efficiency is generally not high, but the heating efficiency is very high, which is always greater than 1. Therefore, one piece can replace the separate heating system and cooling system; [0003] However, in the factory production, there may be bad cooling chips, resulting in the effect of cooling or heating not reaching the intended effect, and the traditional semiconductor cooling chip is very cumbersome to detect, when faced with cooling chips of different sizes It may be necessary to replace tes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/00G01R1/02H05K7/20
CPCG01R31/00G01R1/02H05K7/20145
Inventor 杨海林杨宇翼
Owner NANTONG HONGJINBEI ELECTRONICS TECH CO LTD
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